MIT, TI tip 28-nm processor
Mark LaPedus, EETimes
2/20/2011 9:05 PM EST
In a paper, TI and MIT will present research detailing design methodologies for a 28-nm mobile applications processor with ultra-low power. The paper-entitled ''A 28nm 0.6V Low Power Digital Signal Processor (DSP) for Mobile
To read the full article, click here
Related Semiconductor IP
- Dual Channel 8b D/A Converter - TSMC T40ULP
- Dual Channel 12b D/A Converter - TSMC T40ULP+ESF3
- 8bit D/A Converter - TSMC 22nm ULP
- 12bit 2MSps A/D Converter - TSMC T22ULP
- TSMC 2nm 1V2 GPIO
Related News
- Improved ARM core, other changes in TI mobile app processor
- Express Logic's ThreadX RTOS Supports ARM and TI DSP Processors on Critical Link's MityDSP-L138F Board
- Ambient Scientific AI-native processor for edge applications offers 100x power and performance improvements over 32-bit MCUs
- EnSilica to develop quantum-resilient secure processor chip for critical national infrastructure applications backed by £5m UK Government ‘Contract for Innovation’
Latest News
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer
- Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder