iPhone 7: Will It Have Intel Inside?
Eric Zeman, InformationWeek
October 19, 2015
Apple already relies on Intel to provide the processors for its Mac computers, and may ask the chipmaker to supply a key component for the next-generation iPhone, the so-called iPhone 7. Intel has as many as one thousand engineers working to integrate its 7360 LTE modem with Apple's application processor.
The deal would be a major win for Intel.
To read the full article, click here
Related Semiconductor IP
- 1.6T Ultra Ethernet Controller
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
Related News
- iPhone 7 Sports Intel, TSMC
- iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals
- Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities
- ARM revenues rise 7% sequentially on higher royalties from chip makers
Latest News
- Imec unlocks fourfold UWB range extension using world-first narrowband receiver chip compliant with IEEE 802.15.4ab standard
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology