Infinite Technology's RADcore(TM) Achieves TSMC's Three-Star IP Partner Status
Infinite Technology's RADcore(TM) Achieves TSMC's Three-Star IP Partner Status
RICHARDSON, Texas, March 22 /PRNewswire/ -- Infinite Technology Corporation (Pink Sheets: ITCJ) (ITC) announced its RADcore technology has achieved a three-star status having successfully been ``Verified for Functionality'' in the Taiwan Semiconductor Manufacturing Company (TSMC) 0.25 um CMOS process technology.
The inclusion of RADcore Technology in TSMC's catalog of third party intellectual property providers is an important marketing tool for ITC, placing its company among the industry-leading Intellectual Property (IP) companies and within a global alliance of qualified IC design implementation experts. TSMC's IP Alliance represents the cream of the IP industry. Now designers choosing RADcore Technology for their high-performance datapath solution can be assured the best possible design experience, easiest design reuse and the fastest integration into the overall system design.
``We expect that many of the customer design teams who utilize RADcore Technology will develop consumer oriented products that require ever higher levels of performance. Applications requiring enhanced Digital Signal Processing like those found in 3rd generation (3G) wireless communications, video streaming and multimedia Internet access personal devices are natural targets for application tuned DSP cores based on RADcore Technology,'' said Robert L. Veal, ITC Vice President of Marketing and Sales. Further, Veal said, ``Single-chip implementation is required to ensure these types of products are deployed with a consumer market cost sensitivity. Verifying that these SoC designs work right the first time is critical. Now, design teams can work through the TSMC IP Alliance facilities to verify and manufacture their SoC designs integrating ITC's RADcore DSP-based cores as well as other reusable IP cores.''
RADcore Technology allows system designers to configure DSP coprocessors for specific applications using pre-existing physical libraries, thus providing designers with the added benefit of collapsing the physical design cycle time for DSP cores from months to days. A RADcore coprocessor includes a quad multiply-accumulate (MAC) architecture designed on TSMC's 0.25-micron CMOS process and will achieve typical operating speeds of 350 MHz at 2.5 V and can enable up to 1.4 billion 17x17 MAC operations per second.
``The TSMC Design Services Alliance brings the leaders of required IC design resources (EDA, IP, library providers, and third-party design centers) together to create a robust team to address customer needs from beginning to completion of any IC design cycle,'' said Peyman Kazemkhani, Director of the IP Program at TSMC North America. ``We therefore welcome the inclusion of the ITC RADcore Technology for DSP coprocessor cores as a Three Star Partner for our IP Alliance portfolio.''
About Infinite Technology Corporation
Infinite Technology Corporation, based in Richardson, Texas, is the SemiConductor Original Publishing Enterprise specializing in the design, manufacturing and marketing of digital signal processing (DSP) solutions to create system-on-chip products utilizing its proprietary RADcore(TM) DSP Technology. Founded in 1991, ITC also provides integrated circuit design services and software development. More information can be found at http://www.infinite-tech.com, or by phone at 972.437.7800.
Notes:
1) The statements contained in this release that are not purely historical are forward-looking statements that may involve risks and uncertainties. The Company's actual results may differ significantly from the results contained in the forward-looking statements.
2) RAD, RADcore and RADware are trademarks of Infinite Technology Corporation.
Related Semiconductor IP
- AP Memory VHM Controller
- High-performance, commercial-grade RISC-V CPU Core IP
- SWI3S Verification IP
- Secure Boot Loader
- Memory Subsystem
Related News
- Alphawave Semi Achieves 2025 TSMC OIP Partner of the Year Award for High-Speed SerDes IP
- GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production
Latest News
- StarFive Launches Server-Class RISC-V IP to Accelerate Its Strategic Expansion into AI Computing Infrastructure
- Silvaco Announces Partnership with Dassault Systèmes to Advance First-Time-Right Semiconductor Manufacturing
- Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology
- BrainChip and Neuromorphyx Announce an AKD1500 Embedded Developer Board, Bringing Neuromorphic AI to the Embedded Engineering Community
- M31 Reports Nearly Fourfold Growth in Advanced-Node Royalties as Long-Term Investments Begin to Bear Fruit