HP to Cut More Jobs
Electronics360 News Desk
August 24, 2015
Hewlett-Packard (HP) plans to reduce a further 5% of its workforce in addition to the 55,000 jobs it already plans to eliminate.
To read the full article, click here
Related Semiconductor IP
- Verification IP for C-PHY
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
Related News
- Cadence's Tality subsidiary cuts 200 jobs, closes design centers
- HP helps put VLIW into STMicro's system-chip
- Reconfigurable semiconductor IP start-up raises $14 million - backed by 3i, Actel, HP
- DSP Group reports 7% drop in sales, but 36% rise in licensing revenues
Latest News
- Two Weebit Nano product customers tape-out; one already demonstrating a functional prototype
- JEDEC Advances DDR5 MRDIMM Ecosystem with New Memory Interface Logic and Expanded MRDIMM Roadmap
- Altera Brings Determinism to Physical AI Systems with Latest Release of FPGA AI Suite
- Mosaic SoC raises $3.8M to bring real-time spatial intelligence to every consumer device
- UMC Reports First Quarter 2026 Results