DOLPHIN Integration launches the 32-bit challenger: FlipAPS-32, a processor tiny enough for embedding controls
Meylan, France -- July 21, 2008 -- SoC architectures for advanced technological nodes tend to address explicitly a number of control issues to facilitate their hierarchical organization. It ranges from multiple clock synchronization, to Voltage Islet coordination, through Noise management for high-resolution converters.
Dolphin Integration and Cortus SA are partnering for this 32-bit processor with the silicon area of a 16-bit core and with a minimal power consumption, but with the largest addressing capability. The Built-In-Real-time Debugger, BIRD™, one of Dolphin’s development solutions for the 8051/251 legacy, is readily available for FlipAPS32 to provide the most effective solution for advanced SoC control developments.
"A processor for nanometric processes was missing, and the FlipAPS32 comes with the benefit from the PRIDE™ Development platform which enables a smooth upward migration from 8051 and 80251 through application retargeting with a significant gain of silicon area. In addition, our embedded Memories and unique Standard Cell offering, comments Pauline BUTTIN, Sensor and Controller Marketing Manager, make it quite attractive for direct delivery at the hard level".
Click here for more information or contact logic@dolphin-integration.com
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Dolphin Integration sets up a large range of sponsored IPs at 55 nm to reduce SoC power consumption by up to 70%
- Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box
- Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box
- Dolphin Integration Joins GlobalFoundries FDXcelerator Program to Provide Breakthrough Fabric IP
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release