Dense-Pac applies chip-stacking packaging to DSPs

Dense-Pac applies chip-stacking packaging to DSPs
By Semiconductor Business News
August 30, 2000 (8:56 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000830S0002

GARDEN GROVE, Calif.--Dense-Pac Microsystems Inc. here today introduced a new three-dimensional chip packaging technology for digital signal processors--enabling up to four DSP chips to be stacked on top of each other in a single package.

"In system performance, horse power is king," noted Ted Bruce, president and chief executive officer of Dense-Pac. "You have a significant advantage if you can put more under the hood than your competitors."

Bruce said his company's new Help-Stack package will enable designers to more than double the performance of systems by stacking multiple DSP chips in 3-D configurations, taking up the board space of one processor. The concept is similar to memory stacking.

Dense-Pac said its 3-D stacking technology is suitable for a range of DSP applications, including telecommunications, audio, video, control, and monitoring systems.