Time for a return to the customer-backed joint venture foundry?
Peter Clarke, EETimes
4/20/2012 11:05 AM EDT
Qualcomm and some other companies are leaving money on the table because they can't get enough 28-nm chips to meet demand out of foundry partner Taiwan Semiconductor Manufacturing Co. Ltd. Horror of horrors some customers are looking for ways to switch other companies' chips into slots previously designed around those vendors' ICs.
Could this be one of the ways Intel gets a leg up in the smartphone and tablet computer markets? Whether or not that happens to any significant degree, the current undersupply situation looks set to trigger refinements to some business models.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V Switchable GPIO with I2C, HDMI, LVDS, ESD & Analog in TSMC 28nm
- 10mA, Capless High PSRR LDO Regulator for RF and Analog Applications in TSMC 28nm
- 30mA, Capless High PSRR LDO Regulator for RF and Analog Applications in TSMC 28nm
- 40mA, Capless High PSRR LDO Regulator for RF and Analog Applications in TSMC 28nm
- Real-Time-Clock Analog, Include 32K XOSC, Capaless LDO, POR, VDT - TSMC 28nm
Related News
- STMicroelectronics and NXP unveil management team for joint venture
- IBM and Infineon divest joint venture Altis Semiconductor
- SMIC and Hubei Science & Technology Investment Group Sign Joint Venture Agreement in Wuhan
- ARM, Gemalto and Giesecke & Devrient Form Joint Venture To Deliver Next-Generation Security For Services Running On Connected Devices
Latest News
- JEDEC Advances DDR5 MRDIMM Ecosystem with New Memory Interface Logic and Expanded MRDIMM Roadmap
- Altera Brings Determinism to Physical AI Systems with Latest Release of FPGA AI Suite
- Mosaic SoC raises $3.8M to bring real-time spatial intelligence to every consumer device
- UMC Reports First Quarter 2026 Results
- Rambus Appoints Sumeet Gagneja as Chief Financial Officer