China Warms Up, Slowly, to FD-SOI
8 key FD-SOI stakeholders best positioned to answer 3 FD-SOI FAQs
Junko Yoshida, EETimes
9/17/2015 05:23 PM EDT
SHANGHAI — China is not exactly falling in love with fully depleted silicon on insulator (FD-SOI) technology, but it became clear at the Shanghai FD-SOI Forum this week that the semiconductor industry in Asia is warming up to the idea.
Participants spent little time arguing over the technical merits of FD-SOI in ultra-low power products. As Sanjay Jha, CEO of Globalfoundries, told EE Times, “Nobody is challenging us on the technical validity of FD-SOI.”
Instead, they posed pointed questions on three issues: 1) Who will deliver a family of IP tailored for FD-SOI? 2) What will the ‘entry cost’ be for designing chips on FD-SOI? 3) Do FD-SOI promoters have a technology roadmap beyond 22nm node?
To read the full article, click here
Related Semiconductor IP
- DC-DC Split-Pi Boost-Buck Converter
- Deep learning accelerator
- MIL-STD-1553 Controller IP
- UFS 5.x Device IP
- UCIe 3.x Controller IP
Related News
- STMicroelectronics Secures Additional Sourcing for its Leading-Edge 28nm and 20nm FD-SOI Technology with GLOBALFOUNDRIES
- FDSOI roadmap renames next node as 14-nm
- Altera eyes FDSOI process for FPGAs
- ST-Ericsson opens the way for a new era of smartphones and announces the world's fastest, coolest integrated LTE Modem and Application Processor platform based on FD-SOI
Latest News
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
- Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
- Chipsolve Technologies Appoints Balaji Kanigicherla as Chairman of the Board
- OXMIQ Raises $35 Million to Scale OxCore™ Architecture