CEA‑Leti Advances European FD-SOI Innovation with GlobalFoundries’ Collaboration in the FAMES Pilot Line
GRENOBLE, France – June 11, 2026 – CEA‑Leti, a leading European research institute for microelectronics, today reaffirmed its long‑standing collaboration with GlobalFoundries (GF), whose ongoing participation in the FAMES Pilot Line as an end user is advancing more than two decades of joint work on fully depleted silicon‑on‑insulator (FD‑SOI) technology and reinforcing Europe's leadership in energy‑efficient, sovereign semiconductors. Funded by the European Commission and participating Member States under the Chips JU, FAMES continues to accelerate the early‑stage research shaping the next generation of FD‑SOI.
The FAMES Pilot Line is designed to accelerate early‑stage research and development in advanced semiconductor technologies, with a strong focus on energy efficiency, sustainability and European technological resilience. Industrial participation plays a key role in ensuring that research activities are informed by real‑world application needs.
CEA‑Leti and GF have partnered for more than two decades on PD‑SOI and FD‑SOI technologies across multiple technology generations. Their long‑standing cooperation has contributed to the maturation of FD‑SOI as a differentiated technology option for applications requiring an optimized balance of performance, power efficiency and cost.
Leveraging GF’s FDX™ Platform
One outcome of this partnership is GF’s FDX platform, introduced in 2018 and developed at GF’s Dresden, Germany site. Based on FD‑SOI technology, GF’s 22FDX delivers performance comparable to 14/16nm FinFET nodes for many workloads, while enabling lower power consumption and inherent radiation tolerance. These characteristics make it well‑suited for a broad range of applications, including mobile and consumer devices, automotive microcontrollers, satellite communications, edge AI and emerging computing architectures.
FD‑SOI technologies have also been adopted in demanding environments, including space and other high‑reliability applications, where power efficiency, variability control and robustness are critical.
GF’s participation in the FAMES Pilot Line, as an end user of its early‑stage research, is focused on advancing FD‑SOI capabilities. This includes exploratory work on device enhancements, as well as collaboration on next‑generation substrate innovations, including strained silicon concepts developed within the framework of FAMES and in related programs involving Soitec. These efforts are intended to extend the performance and energy efficiency of FD‑SOI for future application needs.
FAMES Is Key to Strengthening Europe’s Chip Industry
“The FAMES Pilot Line is a cornerstone of Europe’s strategy to strengthen semiconductor research and innovation,” said Sébastien Dauvé, Chief Executive Officer of CEA‑Leti. “Through joint innovation with GlobalFoundries, we accelerate early‑stage FD‑SOI research while maintaining a clear focus on long‑term innovation, sustainability and European technological sovereignty.”
Beyond next-generation FDX devices, GF and CEA-Leti are leveraging the FAMES Pilot Line to advance a broader set of FDX- based programs spanning RF design for 5G/6G power amplifiers, embedded non-volatile memory that will address compute-in-memory for edge AI, ultra-low-power bio-medical wearables, and cybersecure components. Both GF and CEA-Leti also see FAMES as a natural path toward 3D heterogeneous integration on future FDX generations, reinforcing FD-SOI as Europe's most versatile platform for sovereign, energy-efficient silicon.
“GlobalFoundries has a long history of collaboration with CEA‑Leti on FD‑SOI technologies,” said Manfred Horstmann, General Manager and Senior Vice President at GlobalFoundries. “Being an end user of the FAMES Pilot Line reflects our strong interest in early‑stage FD‑SOI research and in supporting Europe’s semiconductor research ecosystem.”
FD‑SOI is widely recognized as a European‑led technology, built through sustained cooperation between research institutes and industry. Through initiatives such as the FAMES Pilot Line, CEA‑Leti and its partners continue to advance foundational technologies that support long‑term competitiveness, energy‑efficient computing and European technological sovereignty.
About CEA-Leti (France)
CEA-Leti, a technology research institute at CEA, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, CEA-Leti pioneers micro-& nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, CEA-Leti’s multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 2,000 talents, a portfolio of 3,200 patents, 14,000 sq. meters of cleanroom space and a clear IP policy, the institute is based in Grenoble (France) and has offices in San Francisco (United States), Brussels (Belgium), Tokyo (Japan), Seoul (South Korea) and Taipei (Taiwan). CEA-Leti has launched 80 startups and is a member of the Carnot Institutes network. Follow us on www.leti-cea.com and @CEA_Leti.
Technological expertise
CEA has a key role in transferring scientific knowledge and innovation from research to industry. This high-level technological research is carried out in particular in electronic and integrated systems, from microscale to nanoscale. It has a wide range of industrial applications in the fields of transport, health, safety and telecommunications, contributing to the creation of high-quality and competitive products.
For more information: www.cea.fr/english
About GF
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other high-growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, visit gf.com.
About FAMES Pilot Line
The FAMES project (“FD-SOI Pilot Line for Applications with NVM Memories, RF and 3D integration, and PMIC to ensure European Sovereignty”) is a major European initiative establishing a pilot line for advanced semiconductor technologies. Funded under the European Chips Act, FAMES focuses on FD-SOI, embedded non-volatile memories, 3D integration, RF components, and Power Management Integrated Circuits to ensure European technological sovereignty. The project includes an open access program to enable semiconductor stakeholders to gain access to the Pilot Line and the FAMES technologies, and a comprehensive training program.
Visit https://fames-pilot-line.eu/
The FAMES Pilot Line of the Chips JU is funded by the Horizon Europe (Grant n°101182279) and Digital Europe (Grant n°101182297) programs and by the National Public Authorities of the partners involved.
Related Semiconductor IP
- USB3.0 PHY on GF22FDX and Samsung 28nm FDSOI
- GLOBALFOUNDARIES 22nm FDSOI LVDS Transceiver Pad
- Samsung 28nm FDSOI USB3.0 and PCIE2 combo PHY
- GLOBALFOUNDARIES 22nm FDSOI USB3.0 Dual Role PHY/OTG PHY
- MIPI D-PHY Transmitter/Receiver for DSI/CSI-2 on Samsung 28nm FD-SOI
Related News
- CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
- CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line
- Soitec launches FD-SOI pilot line in Singapore
- CEA-Leti Announces FAMES Pilot Line In Nature Reviews Electrical Engineering
Latest News
- RISC-V Targets Data Centers, Edge AI, Space
- CEA‑Leti Advances European FD-SOI Innovation with GlobalFoundries’ Collaboration in the FAMES Pilot Line
- Baya Systems Announces Partnership with Openchip on Next-Gen Intelligent Compute
- Startup Ricursive to Create an End-to-End AI Model for Chip Design
- BOS Semiconductors Appoints Dr. Dirk Reimer as Senior Vice President, Sales & Business Development EMEA