Arm’s DreamBig Acquisition Reignites In-house Chip Prospects
By Majeed Ahmad, EETimes | November 11, 2025
DreamBig Semiconductor, featured in this year’s edition of EE Times’ “Silicon 100” list of startups to watch for their chiplet technology, has been acquired by Arm. The revelation came buried in Arm’s latest earnings report, in which the British semiconductor IP supplier agreed to acquire DreamBig for $265 million in October 2025.
“The core technology centers on the MARS chiplet platform, which includes the Chiplet Hub technology with high-bandwidth memory DRAM,” the Silicon 100 report noted in DreamBig’s profile. The Chiplet Hub technology integrates 3D HBM on top of a high-performance fabric base die, providing designers with centralized control of shared hardware resources across attached chiplets.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Minima qualifies to join Arm Flexible Access Program to bring the Minima Chip to Life
- OpenAI Reportedly to Finalize In-House AI Chip Design Soon, Set for TSMC’s 3nm Production
- ARM signs Meta as first chip product customer, says report
- Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs, Redefining the Market Landscape, Says TrendForce
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release