OpenAI Reportedly to Finalize In-House AI Chip Design Soon, Set for TSMC’s 3nm Production
Trendforce (February 12, 2025)
OpenAI, the maker of ChatGPT, is set to finalize its first in-house AI chip design in the coming months, taking a key step toward reducing its reliance on NVIDIA. According to Reuters, the company is expected to send the chips to TSMC for fabrication soon as it aims for mass production in 2026.
Notably, the report suggests that TSMC is producing OpenAI’s AI chip on its 3nm process, featuring a systolic array, HBM, and strong networking—similar to NVIDIA’s design.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging
- Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology
- Reports Indicate TSMC to Tighten Scrutiny on Chinese AI Chip Clients; Potential Revenue Impact Between 5% to 8%
- Chips&Media Secures Access to TSMC 3nm Library
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release