OpenAI Reportedly to Finalize In-House AI Chip Design Soon, Set for TSMC’s 3nm Production
Trendforce (February 12, 2025)
OpenAI, the maker of ChatGPT, is set to finalize its first in-house AI chip design in the coming months, taking a key step toward reducing its reliance on NVIDIA. According to Reuters, the company is expected to send the chips to TSMC for fabrication soon as it aims for mass production in 2026.
Notably, the report suggests that TSMC is producing OpenAI’s AI chip on its 3nm process, featuring a systolic array, HBM, and strong networking—similar to NVIDIA’s design.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- Chips&Media Secures Access to TSMC 3nm Library
- GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers