ARM Unveils its Highest Performing, Most Power-Efficient 4K-Capable Mobile Display Processor 2016-01-20 13:21:00 IP Cores & Design
Rambus Announces R+ 28G Serial Link PHY on Samsung 14nm LPP Process 2016-01-20 07:44:00 IP Cores & Design
Credo Demonstrates 56G PAM-4, 56G NRZ and 28G NRZ SerDes Technology at DesignCon 2016-01-20 07:40:00 Misc
Synopsys Unveils SiliconSmart ADV Cell Library Characterization Solution 2016-01-20 03:10:00 EDA & Design Tools
IntoPIX Announces Its New Generation Of AES IP-Cores Supporting Higher Bitrate Up To 10/100 Gbps With Optimized Footprint To Secure Network Transmission In AV Applications. 2016-01-19 16:06:00 IP Cores & Design
Telink Semiconductor Launches World's First All-in-One System-on-Chip for the Internet of Things 2016-01-19 16:00:00 SoC Architecture & Assembly
QuickPlay Redefines FPGA Design, Significantly Reducing Development Cost and Time-to-Market 2016-01-19 15:18:00 EDA & Design Tools
WiLAN Subsidiary, North Star Innovations, Inc., Enters Into License Agreement With GLOBALFOUNDRIES 2016-01-19 13:56:00 Legal & IP Strategy
CEVA-XM4 Imaging and Vision DSP Named "Best Processor IP of 2015" by The Linley Group 2016-01-19 13:53:00 Misc
HiSilicon Adopts Cadence Innovus Implementation System for Production DSP Designs 2016-01-18 17:18:00 EDA & Design Tools
Qualcomm and Guizhou Province Sign Strategic Cooperation Agreement and Form Joint Venture to Design and Sell World-Class Server Chipsets in China 2016-01-18 15:50:00 Strategic Partnerships