Imagination Technologies: Chief Executive change, trading update and restructuring initiatives 2016-02-08 10:00:00 Strategic Partnerships
Cadence to Showcase Tensilica DSPs and Design IP at Mobile World Congress 2016 2016-02-08 02:51:00 Misc
SK hynix, Inc., Amkor Technology, Inc., eSilicon, Northwest Logic and Avery Design Systems Announce "Start your HBM/2.5D Design Today" Seminar 2016-02-04 15:10:00 Misc
Barco Silex launches OEM board for pro AV market, enabling 4K/UHD HDMI transport over IP 2016-02-04 15:05:00 SoC Architecture & Assembly
Cortus and Aspen Logic Offer Educational Webinar on Creating ASICs to Enable IoT & M2M Products to Stand Out 2016-02-04 01:30:00 Misc
Imec and Vrije Universiteit Brussel Present Small, Low-Cost and Low-Power Chip for multi-gigabit 60GHz Communication 2016-02-03 16:09:00 IP Cores & Design
Synopsys' 10 Gbps USB 3.1 IP First to Pass USB-IF Certification 2016-02-03 15:11:00 IP Cores & Design
Intopix Announces Availability Of TICO IP-Cores Supporting UHDTV1 And 4K Up To 60 Fps In 4:4:4 Color Space With A Low Cost FPGA Footprint 2016-02-03 14:28:00 IP Cores & Design
Xilinx Announces Data Center Ecosystem Investment Program to Broaden Cloud Computing and NFV Acceleration Solutions 2016-02-03 14:00:00 Strategic Partnerships
e2v strengthens semiconductors business with acquisition of Signal Processing Devices 2016-02-03 13:57:00 Strategic Partnerships
New Cadence Modus Test Solution Delivers Up to 3X Reduction in SoC Test Time 2016-02-03 13:09:00 EDA & Design Tools