NXP Embraces 28nm FDSOI for MCUs
Peter Clarke, EETimes
1/18/2016 04:10 PM EST
PARIS—NXP is set to extend the use of 28nm fully-depleted silicon-on-insulator (FDSOI) process technology down to its low-power LPC microcontrollers, according to Goeff Lees, newly installed as general manager of MCU business at NXP Semiconductors NV.
Lees was speaking at an event to intended to emphasize that the enlarged NXP, after its merger with Freescale, is well place to offer processers, security and software for the Internet of Things in all of its various vertical applications, whether in the consumer, industrial, medical or automotives sectors.
To read the full article, click here
Related Semiconductor IP
- Mesochronous Bridge for PCIe/CXL
- AI-native GPU
- OpenGMSL Verification IP
- OpenGMSL Leaf IP
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
Related News
- NXP Taps into FD-SOI Technology to Enable the Industry's Lowest Power General Purpose Applications Processors
- NXP Goes All In on FD-SOI
- NXP Delivers Industry's First ARM Cortex-M0 Microcontrollers with Integrated USB Drivers
- NXP Ships World's Fastest ARM Cortex-M4 and Cortex-M3 Microcontrollers
Latest News
- SignatureIP Unveils MesoLink, a Mesochronous Bridge for PCIe/CXL Validation
- ICTK Partners with Jiran Security to Drive Post-Quantum Cryptography (PQC) Migration
- S2C Named Andes Technology’s 2026 Partner of the Year
- BrainChip Launches AKD1500 PCIe Card For Edge AI Evaluation Everywhere
- TDK-Micronas adopts Aniah’s AI-powered OneCheck® platform to advance automotive semiconductor development