Arteris and Alibaba DAMO Academy Extend Partnership to Accelerate High-Performance RISC-V SoC Designs 2025-10-22 13:08:00 Strategic Partnerships
Ashling and Embecosm Extend PyTorch AI to RISC-V Embedded Devices 2025-10-22 12:05:24 SoC Architecture & Assembly
CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst Program 2025-10-22 09:36:49 IP Cores & Design
UMC Introduces 55nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive Applications 2025-10-22 06:22:00 Foundries & Process Nodes
SmartDV Announces Multiple Customer Licenses for MIPI® SoundWire® I3S℠ 1.0 IP Portfolio 2025-10-22 05:59:00 Commercial Deals
Sofics Tapes Out Test Chip on TSMC 4nm Process with Novel ESD IP and Low-Power 1.8V and 3.3V GPIO Solutions 2025-10-21 15:17:25 IP Cores & Design
ChipAgents Raises Oversubscribed $21M Series A to Redefine AI for Chip Design 2025-10-21 14:53:00 Strategic Partnerships
Ceva Introduces Wi-Fi 7 1x1 Client IP to Power Smarter, More Responsive AI-Enabled IoT Devices and Emerging Physical AI Systems 2025-10-21 11:05:00 IP Cores & Design
Menta Brings its Pioneering eFPGA Technology to Embedded World North America 2025 2025-10-21 06:55:11 Events & Conferences
JEDEC’s SOCAMM2: Low Power Compact LPDDR5X Modules Poised to Power Next-Gen AI Servers 2025-10-20 14:11:29 Standards & Interconnects
Arm Accelerates the Edge AI Revolution with Easy, Low-Cost Access to Armv9 Platforms through Arm Flexible Access 2025-10-20 13:12:28 IP Cores & Design
NEXT Semiconductor Announces Availability of its' Full Waveform Capture Digital LiDAR Processor 2025-10-20 12:17:08 SoC Architecture & Assembly
Soitec and CEA partner to develop automotive cybersecurity with advanced FD-SOI technology 2025-10-20 12:09:38 Foundries & Process Nodes
Alphawave Semi Achieves 2025 TSMC OIP Partner of the Year Award for High-Speed SerDes IP 2025-10-20 12:02:00 IP Cores & Design