Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation 2021-08-19 02:27:00 EDA & Design Tools
Arasan Chip Systems announces its 2'nd Generation Sureboot QSPI IP 2021-08-18 08:36:00 IP Cores & Design
Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications 2021-08-18 07:49:00 IP Cores & Design
Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready Memory Subsystem 2021-08-17 08:30:00 IP Cores & Design
Major Update to MIPI DSI-2 Specification Enables Advancements in Mobile Displays 2021-08-17 06:22:00 Misc
The Worldwide Semiconductor Market is expected to show an outstanding growth-rate of 25.1 percent in 2021 2021-08-16 15:28:00 Analysis & Insight
Renesas and Dialog Semiconductor Announce Conclusion of Final Regulatory Review and the Expected Closing Date for Renesas' Proposed Acquisition of Dialog Semiconductor 2021-08-16 14:38:00 Strategic Partnerships
Motivo, Inc. Raises $12 Million Series A to Accelerate AI-Enabled Chip Design and Improve Manufacturing Yields 2021-08-16 13:57:00 Strategic Partnerships
Tower Semiconductor and Cadence Announce New Reference Flow for Advanced 5G Communications and Automotive IC Development 2021-08-16 13:46:00 EDA & Design Tools
Palma Ceia SemiDesign Named to EE Times "Silicon 100 Startups Worth Watching In 2021" 2021-08-16 09:48:00 Misc
Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems 2021-08-12 10:06:00 SoC Architecture & Assembly