Teledatics Introduces World's First Open Wi-Fi "HaLow" Development Platform 2021-12-20 06:34:00 SoC Architecture & Assembly
SiPearl awarded a €17.5M funding from the EIC Accelerator program 2021-12-20 04:31:00 Strategic Partnerships
Gowin Automotive-grade FPGAs Pass SAIC's 2500h Heat Resistance Tests 2021-12-17 08:10:00 SoC Architecture & Assembly
Industry's fastest TLS accelerator ready to boost Xilinx Versal platform 2021-12-16 16:44:00 IP Cores & Design
Lattice Expands Automate Solution Stack and Propel Design Tool Capabilities to Accelerate Industrial Application Development 2021-12-16 16:40:00 SoC Architecture & Assembly
StarFive Released Open-Sourced Dubhe Linux SDK in RVspace Community 2021-12-16 16:40:00 SoC Architecture & Assembly
TSMC Presents 2021 Excellent Performance Award to Outstanding Suppliers 2021-12-16 16:40:00 Foundries & Process Nodes
3Q21 Revenue of Global Top 10 IC Design (Fabless) Companies Reach US$33.7 billion, Four Taiwanese Companies Make List, Says TrendForce 2021-12-16 16:40:00 Analysis & Insight
Secure Thingz and Intrinsic ID Partner to Ensure Supply Chains of Trust for the Embedded Industry 2021-12-16 16:40:00 Strategic Partnerships
Atomic Rules introduces the world's highest performance PCIe host interface for Intel Agilex F-Series FPGAs 2021-12-16 16:40:00 IP Cores & Design
Synopsys Initiates $200 Million Accelerated Share Repurchase Agreement 2021-12-16 16:40:00 Strategic Partnerships
Synopsys SiliconSmart Library Characterization Solution Achieves Certification for TSMC N5, N4 and N3 Advanced Processes 2021-12-16 16:40:00 EDA & Design Tools
MediaTek Dimensity 9000 uses Armv9 technology for unparalleled performance 2021-12-16 11:05:00 Commercial Deals
Ultra-Low power GNSS Multi-Constellation Digital IP core available for Battery powered IoT devices and Smart Wearables SoC application 2021-12-15 08:08:00 Misc
Cliosoft Selected for Rapid Assured Microelectronics Prototypes (RAMP) Program 2021-12-15 01:40:00 EDA & Design Tools