Faraday Announces the most competitive USB 3.0 PHY in UMC 0.11um Aluminum Process 2010-12-09 10:32:00 IP Cores & Design
Gartner Says Worldwide Semiconductor Revenue Increased 31.5 Percent in 2010 to Exceed $300 Billion 2010-12-09 08:10:00 Analysis & Insight
Renesas Electronics Announces Development of the Basic Structure for Embedded DRAM with High Compatibility with Standard CMOS Logic Circuits 2010-12-09 08:04:00 IP Cores & Design
Imagination extends standards supported on ENSIGMA UCCP family with International ISDB-T 2010-12-09 07:39:00 IP Cores & Design
Samsung and Ambarella Announces ASIC Partnership on 45nm High-Performance, Low-Power HD Hybrid Camera SOCs 2010-12-08 18:16:00 SoC Architecture & Assembly
Forte Design Systems' SystemC High-Level Synthesis Selected for Fujitsu Semiconductor's ASIC Reference Flow 2010-12-08 15:22:00 EDA & Design Tools
Cambridge Analog Technologies Appoints Semiconductor IP Veteran Didier Lacroix to Advisory Board 2010-12-08 15:15:00 People & Leadership
Renesas Electronics and Green Hills Software Collaborate to Jointly Develop Basic Software for CPU Virtualization Technology Enabling Real-Time Control 2010-12-08 12:46:00 SoC Architecture & Assembly
Cadence C-to-Silicon Compiler Supported in Fujitsu Semiconductor’s ASIC Flow for System Realization 2010-12-08 12:43:00 EDA & Design Tools
Synopsys Expands DesignWare MIPI IP Portfolio With DSI Host Controller 2010-12-07 15:07:00 IP Cores & Design
Rambus Unveils New Model to Monitor Energy Consumption in DRAM Devices 2010-12-07 14:23:00 EDA & Design Tools
IntegrIT's Math Library Now Available for Tensilica's HiFi Audio DSPs 2010-12-07 14:20:00 SoC Architecture & Assembly
Arteris Network-on-Chip (NoC) IP Selected by Mobileye for Camera-Based Driver Assistance Systems (DAS) SoC 2010-12-07 07:50:00 Commercial Deals