Xilinx Introduces Zynq-7000 Family, Industry's First Extensible Processing Platform 2011-03-01 09:19:00 SoC Architecture & Assembly
CEVA and Arteris Partner on Multi-Core Interconnect for Next Generation SoC Designs 2011-03-01 07:34:00 Strategic Partnerships
Cadence Opens and Extends Verification IP Catalog for Use Across Silicon, SoC and System Development 2011-02-28 15:08:00 Verification IP
Synopsys DesignWare IP First to Support Final Release of PCI Express 3.0 Specification 2011-02-28 15:04:00 IP Cores & Design
NXP and ARM Extend Strategic Licensing Agreement for Microcontrollers 2011-02-28 13:38:00 Commercial Deals
Fujitsu Semiconductor and ARM Sign Comprehensive License Agreement 2011-02-28 11:11:00 Commercial Deals
InterDigital to Deliver SlimChip Modem Core to New Entrant to Mobile Chipset Market in China 2011-02-28 11:09:00 Commercial Deals
Evatronix and Avery Announce Partnership for SuperSpeed USB 3.0 IP Development and Verification 2011-02-28 07:38:00 Strategic Partnerships
ARM Cortex-M3 Reference Platform Running Micrium uC/OS II Released On OVP 2011-02-28 01:17:00 SoC Architecture & Assembly
The first configuration of Dolphin Integration stars an audio converter at 40 nm LP to a high SNR of 100 dB 2011-02-25 18:29:00 IP Cores & Design
Duolog Extends Solutions to Support EDA360 Vision in Collaboration With Cadence 2011-02-25 08:29:00 EDA & Design Tools
Imec and Renesas Electronics Announce Development of an Innovative SAW-Less Reconfigurable Transceiver 2011-02-25 08:16:00 IP Cores & Design
MIPS Technologies Signs License to Distribute OEM Version of the Imperas Open Virtual Platforms Simulator 2011-02-24 17:17:00 Strategic Partnerships
InterDigital Signs SII Mobile Communications to Worldwide Patent License Agreement 2011-02-24 17:14:00 Commercial Deals