4G/LTE chips coming . . . but first, a little chaos
Junko Yoshida, EETimes
(03/22/2010 9:04 AM EDT)
NEW YORK — When the CTIA wireless show opens this week, attendees will see how earnestly the wireless industry has applied itself to moving to 4G LTE/WiMax cellular networks -- including learning more in detail Sprint Nextel's plans for its WiMax mobile phones.
But be warned. Much of the WiMax/LTE solutions on display at the show are still point solutions. This represents a prelude to the chaos and confusion which, in the coming months, many technology vendors will be busy unraveling.
In the transition to WiMax/LTE, however, one thing will be clear to everyone. There's no going back to business as (it was) usual.
Gone are the days when baseband chip vendors could continuously hold onto their existing 3G/2G solutions -- many of them hard-wired. On the horizon is the industry's growing appetite for DSPs -- specifically designed to run software defined radio (SDR).
At least, that's the operative theory for CEVA, a DSP core intellectual property supplier.
To read the full article, click here
Related Semiconductor IP
- Camera Post-Processing IP
- DC-DC Split-Pi Boost-Buck Converter
- Deep learning accelerator
- MIL-STD-1553 Controller IP
- UFS 5.x Device IP
Related News
- NetLogic Microsystems Announces the Industry's Widest Bandwidth Digital Front End Processors for 3G and 4G/LTE Base Stations
- STARCHIP Announces the Sampling of its SCF670H SIM Controller to tackle the 4G/LTE market
- Aviacomm adopts M31 MIPI M-PHY IP for 4G-LTE RF transceiver solutions for mobile devices
- Samsung Foundry Adopts Leading Voltage-Timing Signoff Solution from Synopsys and Ansys for Advanced-Node, Energy-Efficient Chips
Latest News
- VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
- Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
- Chipsolve Technologies Appoints Balaji Kanigicherla as Chairman of the Board