SEMI Reports 2013 Global Semiconductor Materials Sales of $43.5 Billion
SAN JOSE, Calif. — April 7, 2014 — The global semiconductor materials market decreased 3 percent in 2013 compared to 2012 while worldwide semiconductor revenues increased 5 percent. Revenues of $43.5 mark the second consecutive year of contraction for the semiconductor materials market.
Total wafer fabrication materials and packaging materials were $22.76 billion and $20.70 billion, respectively. Comparable revenues for these segments in 2012 were $23.44 billion for wafer fabrication materials and $21.36 billion for packaging materials. For the second year in a row, substantial declines in silicon revenue, advanced substrates, and bonding wire contributed to the year-over-year decrease to the total semiconductor materials market.
For the fourth consecutive year, Taiwan was the largest consumer of semiconductor materials due to its large foundry and advanced packaging base, despite not experiencing any annual growth. The materials market in North America also remained flat year-over-year. The materials markets in China and Europe increased in 2013, benefiting from strength in wafer fab materials. The materials market in Japan contracted 12 percent, with markets also contracting in South Korea and Rest of World. (The ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets.)
2012-2013 Semiconductor Materials Market by World Region
(Dollar in U.S. billions; Percentage Year-over-Year)
| Region | 2012* | 2013 | % Change |
| Taiwan | 8.97 | 8.96 | 0% |
| Japan | 8.24 | 7.29 | -12% |
| South Korea | 7.22 | 6.94 | -4% |
| Rest of World | 7.17 | 6.76 | -6% |
| China | 5.50 | 5.70 | 4% |
| North America | 4.75 | 4.75 | 0% |
| Europe | 2.95 | 3.07 | 4% |
| Total | 44.80 | 43.46 | -3% |
Source: SEMI April 2014
Note: Figures may not add due to rounding.
* 2012 data were revised based on the recently released Global Semiconductor Packaging Materials Outlook- 2013/2014.
The Material Market Data Subscription (MMDS) from SEMI provides current revenue data along with seven years of historical data and a two-year forecast. A year subscription includes four quarterly updates for the material segments reports revenue for seven market regions (North America, Europe, ROW, Japan, Taiwan, South Korea, and China). The report also features detailed historical data for silicon shipments and revenues for photoresist, photoresist ancillaries, process gases and leadframes. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers).
SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- Global Semiconductor Sales Increase 15.8% from Q2 to Q3; Month-to-Month Sales Grow 7.0% in September
- Global Semiconductor Sales Increase 4.7% Month-to-Month in October
- Global Semiconductor Sales Increase 29.8% Year-to-Year in November
- Global Annual Semiconductor Sales Increase 25.6% to $791.7 Billion in 2025
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools