Why Sidense OTP is Like the Armored Car of NVM
September 24, 2015
I have written about Sidense before, but last week at the TSMC Open Innovation Platform Forum, I had a chance to hear a talk by, and have lunch with Betina Hold Director of R&D at Sidense. Here is what I learned.
Sidense has been focusing on the growing market in what they like to call the smart connected universe. It is best to think of this as the union of mobile, IoT, wearables, medical, industrial and automotive. Incidentally Automotive was a hot topic at the OIP Forum.
To read the full article, click here
Related Semiconductor IP
- Digital and mixed-signal IP and ASIC RISC-V reference design for USB Type-C/PD power adapter/charger
- Resistive RAM - High-Performance Memory
Related Blogs
- The Future of AI is Modular: Why the SiFive-NVIDIA Milestone Matters
- The Rise of Physical AI and Robotics: Why Hardware-Based Security is Non-Negotiable
- The Future of Driving: How Advanced DSP is Shaping Car Infotainment Systems
- Rethinking Edge AI Interconnects: Why Multi-Protocol Is the New Standard
Latest Blogs
- Beyond Trusted: What the NSA’s New Guidance Means for Hardware Security
- A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- Navigating ISO 26262 Part 11: A Guide for Semiconductor Architects
- Embedded Security explained: Digital signatures
- Hardware security verification must go beyond functional testing