No More Cheap Wafers, says Future Horizons
Leading edge capacity will never again be a commodity. Recent trends are making manufacturing more valuable and scarce, according to Future Horizons whose IEF 2011 conference in Seville started this morning.
The trend to go fabless at 65nm, the trend to $3bn fabs reducing the number of IDMs and foundries which can afford them, the trend for capacity to lag demand rather than lead it, and the trend to 450mm, are combining to make leading edge capacity limited, expensive and tight.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related Blogs
- Wafer Prices Rising As Supply Lags Demand
- TSMC Wafer Allocation and Design Migration
- DDR3/DDR2 price crossover reached
- What's happening on the 450mm wafer front?
Latest Blogs
- Embedded Security explained: Advanced Encryption Standard (AES)
- Cadence Demonstrates PCIe 8.0 PHY at PCI-SIG DevCon 2026
- Cadence Achieves Successful Silicon Validation of 1st IP Test Chips on Intel 18A
- From Classical CAN and CAN FD to CAN XL: Functional Safety and Security for Next-Generation In-Vehicle Communication
- Accelerating Embedded Memory Performance with 16-bit xSPI PSRAM IP