Teardown of Verizon’s Apple iPhone reveals chips used
One of the most anticipated product rollouts of the year is already happening this week—the Verizon CDMA version of the Apple iPhone—and two organizations have already done us the great favor of tearing a sample phone apart and enumerating the significant chips found inside. The two organizations are UBM TechInsights (affiliated with EE Times) and ifixit.com. And you know what? They seem to have torn apart slightly different versions.
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Blogs
- Where will Apple Manufacture the next iPhone Brain?
- Apple iPhone 6S: LPDDR4 arrives at Apple
- Who Will Get the Next Bite of Apple Chip Business?
- From IBM Mainframes to Wintel PCs to Apple iPhones: 70% is the Magic Number
Latest Blogs
- Beyond Trusted: What the NSA’s New Guidance Means for Hardware Security
- A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- Navigating ISO 26262 Part 11: A Guide for Semiconductor Architects
- Embedded Security explained: Digital signatures
- Hardware security verification must go beyond functional testing