Teardown of Verizon’s Apple iPhone reveals chips used
February 11, 2011
One of the most anticipated product rollouts of the year is already happening this week—the Verizon CDMA version of the Apple iPhone—and two organizations have already done us the great favor of tearing a sample phone apart and enumerating the significant chips found inside. The two organizations are UBM TechInsights (affiliated with EE Times) and ifixit.com. And you know what? They seem to have torn apart slightly different versions.
Related Semiconductor IP
- MIL-STD-1553 Controller IP
- UFS 5.x Device IP
- UCIe 3.x Controller IP
- Ethernet 800G PCS IP
- CHI to UCIe Bridge IP
Related Blogs
- Where will Apple Manufacture the next iPhone Brain?
- Apple iPhone 6S: LPDDR4 arrives at Apple
- Who Will Get the Next Bite of Apple Chip Business?
- From IBM Mainframes to Wintel PCs to Apple iPhones: 70% is the Magic Number
Latest Blogs
- CDM Dependence on Device Capacitance
- What the Cyber Resilience Act means for the future of chip design
- When Your IP Vendor Has Operated 150,000 Base Stations: Introducing Viettel Semiconductor
- Relationship between architecture and validation in system design
- The Post-Quantum Cryptography Mandate: Building Cryptographically Agile Systems for the Quantum Era