Teardown of Verizon’s Apple iPhone reveals chips used
February 11, 2011
One of the most anticipated product rollouts of the year is already happening this week—the Verizon CDMA version of the Apple iPhone—and two organizations have already done us the great favor of tearing a sample phone apart and enumerating the significant chips found inside. The two organizations are UBM TechInsights (affiliated with EE Times) and ifixit.com. And you know what? They seem to have torn apart slightly different versions.
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related Blogs
- Where will Apple Manufacture the next iPhone Brain?
- Apple iPhone 6S: LPDDR4 arrives at Apple
- Who Will Get the Next Bite of Apple Chip Business?
- From IBM Mainframes to Wintel PCs to Apple iPhones: 70% is the Magic Number
Latest Blogs
- AI in Design Verification: Where It Works and Where It Doesn’t
- PCIe 7.0 fundamentals: Baseline ordering rules
- Ensuring reliability in Advanced IC design
- A Closer Look at proteanTecs Health and Performance Management Solutions Portfolio
- Enabling Memory Choice for Modern AI Systems: Tenstorrent and Rambus Deliver Flexible, Power-Efficient Solutions