TSMC Versus Intel: The Race to Semiconductors in 3D!
While Intel is doing victory laps in the race to a 3D transistor (FinFet) @ 22nm, TSMC is in production with 3D IC technology. A 3D IC is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The question is which 3D race is more important to the semiconductor industry today?
To read the full article, click here
Related Semiconductor IP
- SpaceWire Node IP core
- nQrux Secure Boot
- 4K/8K Multiformat IP supporting AV2 decoder
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
Related Blogs
- TSMC (Lincoln) vs Samsung (Clinton) vs Intel (Washington)
- Can Intel Beat TSMC?
- TSMC vs Intel vs Samsung FinFETs
- Intel vs. Intel
Latest Blogs
- A Repeatable Framework for Hardware Security Assurance
- Inside the SiFive Performance™ P570 Gen 3: High Performance Efficiency for Next-Generation Consumer and Commercial Applications
- What the steam engine can teach us about modern chip design
- Automotive silicon in the era of AI, functional safety, and cybersecurity
- JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA