TLM: The Year in Review, and Trends for 2012
2011 was my first full year in the land of Transaction-Level Modeling (TLM) design and verification, after spending my entire career to that point in RTL. I made my move upward in abstraction level in mid-2010 because it seemed like the time had finally come for this methodology to start becoming mainstream, delivering the benefits that have been sought for years.
Has this methodology started to become mainstream?
To read the full article, click here
Related Semiconductor IP
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
- Junction Over-Temperature Detector with Linear Centigrade-to-Voltage Output - X-FAB XT018
- Performance P570 Gen 3
Related Blogs
- Predictions for 2012: Industry trends
- Jim Hogan's top six SoC trends for 2012. Want to know what they are?
- Update on global semicon trends 2012-13
- Semiconductor and EDA Forecasts 2011 / 2012
Latest Blogs
- Inside the SiFive Performance™ P570 Gen 3: High Performance Efficiency for Next-Generation Consumer and Commercial Applications
- What the steam engine can teach us about modern chip design
- Automotive silicon in the era of AI, functional safety, and cybersecurity
- JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA
- Beyond PCIe Compliance: Why Stress Testing Is Crucial for Edge AI Deployments