Navigating the challenges of manual IP design migrations
In semiconductor design, the migration of IP across different technology nodes is a complex but business critical process. This task, traditionally manual, involves a detailed analysis of source and target technologies, migration of schematics and testbenches, and iterative design adjustments to meet specific performance requirements for the final design layout.
The challenges of manual migration
The manual process is intricate and lengthy, taking weeks to months, depending on the complexity of the circuit and IPs involved. Designers must deeply understand circuit behavior across Process, Voltage, and Temperature (PVT) corners, and engage in extensive simulations and iterations to achieve the desired specifications.
Additionally, the rate at which new technology nodes are introduced is accelerating, with each new node introducing more design rule complexity, leading to higher development costs and greater pressure on engineering resources due to the additional time needed to manage the migration process.
A shortage of skilled engineers further complicates the situation, not only extending design timelines and inflating costs due to the premium on expert talent, but also putting companies at risk of falling behind in the fiercely competitive race to secure fab capacity.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related Blogs
- Maximizing the Usability of Your Chip Development: Design with Flexibility for the Future
- The Blind Spot of Semiconductor IP Sales
- Building Smarter, Faster: How Arm Compute Subsystems Accelerate the Future of Chip Design
- Cadence at the TSMC OIP: Pioneering the Future of Semiconductor Design
Latest Blogs
- Cadence Achieves Successful Silicon Validation of 1st IP Test Chips on Intel 18A
- From Classical CAN and CAN FD to CAN XL: Functional Safety and Security for Next-Generation In-Vehicle Communication
- Accelerating Embedded Memory Performance with 16-bit xSPI PSRAM IP
- Why nonce reuse can break AES-GCM security in embedded systems
- PQSecure™-Agility Earns NIST CAVP Validation