The Future is the Interconnect: IITC
May 21, 2012
The next International Interconnect Technology Conference (IITC 2012) will be held in San Jose in a couple of weeks (June 4-6). This is a good opportunity to recall that, in some sense, the reason for scaling silicon down has changed in recent years from packing more transistors in a square (or cubic) millimeter to increasing functionality and performance at reduced power. An ever higher fraction of the power dissipation resides in the interconnect – both in the net switching itself as well as in the ever-increasing number of repeaters required to re-power more and more “long” nets.
To read the full article, click here
Related Semiconductor IP
- Mesochronous Bridge for PCIe/CXL
- AI-native GPU
- OpenGMSL Verification IP
- OpenGMSL Leaf IP
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
Related Blogs
- Xilinx announces first stacked silicon interconnect technology
- Intel, Arm, 3D FinFETs & mobile computing's future
- Is the 1-chip PC looming in the future?
- Semiconductor supply chain dynamics: Future Horizons @ IEF2011
Latest Blogs
- Automated, Faster Specification to Sign-Off with IDS-AI
- NovaTech Automation Crius PIU: Bringing Conventional Instrument Transformers onto the IEC 61850 Process Bus
- Single Pair Ethernet and TSN: The In-Robot Network Behind the Next Humanoid Robots
- A design path to success exists for ultra-low-voltage SoCs
- Where Routine Flow Ends Veriest Formal Expertise Begins