Intel's Master-Plan
July 13, 2012
You can see why Intel decided to accept ASML's offer to invest in it -because the difference between the plans of Intel and TSMC on when to start 450mm production, and the plans of ASML on when to produce a 450mm lithographic machine is comical.
TSMC says it intends to start trial production on 450mm wafers in 2013-14 and to be in volume production in 2015-16.
Intel says it will be getting first generation 450mm tools in 2015 and will start making ICs on it. In 2016/2017 second generation 2 tools will be delivering real productivity and Intel will then start upgrading its existing fabs."
To read the full article, click here
Related Semiconductor IP
- SpaceWire Node IP core
- nQrux Secure Boot
- 4K/8K Multiformat IP supporting AV2 decoder
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
Related Blogs
- TSMC Could Make Half Of Intel's Atom Output
- Intel’s Atom-based Tunnel Creek SOC with integrated PCIe interface opens new era for embedded developers
- McAfee is Intel’s Foot in the Door
- Intel's McAfee buy: Too few answers to too many questions, for now!
Latest Blogs
- A Repeatable Framework for Hardware Security Assurance
- Inside the SiFive Performance™ P570 Gen 3: High Performance Efficiency for Next-Generation Consumer and Commercial Applications
- What the steam engine can teach us about modern chip design
- Automotive silicon in the era of AI, functional safety, and cybersecurity
- JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA