How Collaboration Will Accelerate Adoption of Multi-Die Systems
Welcome to the wonderfully complex and rich world of multi-die systems. Breaking free from the monolithic SoC mold, multi-die systems integrate heterogeneous dies into a single package. This relatively new architecture is steadily transforming the semiconductor industry by allowing chip designers to reach new heights of functionality with higher compute power and the ability to reuse proven dies, enabling more powerful systems in phones, computers, and even self-driving cars. However, with rapid advancement comes challenges, many of which were discussed at last month’s Accelerating Mainstream Adoption of Multi-Die Systems panel discussion, hosted by Synopsys.
This virtual event brought together Murat Becer, vice president of research and development at Ansys, Inc.; Michael Schaffert, senior vice president at Bosch; Cheolmin Park, corporate vice president at Samsung; Lalitha Immaneni, vice president of architecture, design, and technology solutions at Intel; and Shekhar Kapoor, senior director of product line management at Synopsys. The panel was moderated by Marco Chiapetta, co-founder and principal analyst at HotTech Vision and Analysis, and touched on the current state of multi-die system design, its applications, and the industry’s expectations for multi-die system adoption.
Read on for highlights from the panel and insights into why industry leaders believe collaboration is critical to accelerating the adoption of multi-die systems.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Blogs
- How Multi-Die Systems Create New Business Opportunities for Semiconductor Companies
- Five Key Techniques to Accelerate Software Bring-Up for Multi-Die Systems
- How Photonics Can Light the Way for Higher Performing Multi-Die Systems
- The Future of Driving: How Advanced DSP is Shaping Car Infotainment Systems
Latest Blogs
- DDR5 MRDIMM Gen2: The Missing Link in Scaling AI Infrastructure
- How Cache Coherency Simplifies AI Software
- Multiple neuromorphic chips, one grid, no new middleware
- Beyond Trusted: What the NSA’s New Guidance Means for Hardware Security
- A scalable, shader-programmable vector graphics GPU core for low-power MCUs