Foundries Have Stepped Up To The Challenge, says ARM VP
The foundry industry has motored to catch up with Intel on process technology.
“In the last couple of years, with Intel being forthright about getting into in the mobile space and quoting process node advantage as a way to leadership in the marketplace, that has woken up the foundries to the challenge,” says ARM vp Noel Hurley.
Now, TSMC, Samsung, and GloFo are all saying they’ll be out with mobile SOCs on 14/16nm this year. That is the same timing as Intel which says it will be producing on 14nm this year.
“The foundry group have stepped up to the challenge and, on the IP side, we have stepped up,” says Hurley.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Blogs
- Can All The Riches Of Arabia Loosen TSMC's Grip On The Foundry Industry?
- Should Intel Offer Foundry Services?
- Can Intel be a Leading Semiconductor Foundry?
- Will Intel leave Mobile, Foundry, and FPGA Business?
Latest Blogs
- How Cache Coherency Simplifies AI Software
- Multiple neuromorphic chips, one grid, no new middleware
- Beyond Trusted: What the NSA’s New Guidance Means for Hardware Security
- A scalable, shader-programmable vector graphics GPU core for low-power MCUs
- Navigating ISO 26262 Part 11: A Guide for Semiconductor Architects