TSMC tips 450-mm fab
Mark LaPedus, EETimes
1/31/2011 3:33 PM EST
As reported, Intel, Samsung and TSMC are pushing hard for 450-mm fabs. Amid a flurry of speculation, Intel Corp. confirmed that its new fab in the United States is being constructed for the 450-mm wafer era.
Now, TSMC tipped its plans. ''Last week, (TSMC CEO) Morris Chang obsoleted the world’s 300-mm with the blast of a conference call,'' said G. Dan Hutcheson, CEO of VLSI Research Inc., in a report.
To read the full article, click here
Related Semiconductor IP
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
Related News
- ESMC Breaks Ground on Dresden Fab
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
- Commentary: Get ready for 450-mm fabs
- Intel, Samsung Electronics and TSMC Reach Agreement for 450mm Wafer Manufacturing Transition
Latest News
- Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem