Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology
LONDON, UK -- April 27,2026 -- Crypto Quantique, a leader in quantum-driven security for the Internet of Things (IoT), today announced an enhanced collaboration with Attopsemi Technology, a premier provider of One-Time Programmable (OTP) IP. Together, the companies are delivering a highly optimised integration of Crypto Quantique’s latest QDID™ PUF technology with Attopsemi’s I-fuse® OTP at TSMC’s 12nm FinFET process.
This partnership significantly simplifies the adoption of unique hardware root-of-trust for advanced semiconductor devices, making Physical Unclonable Functions (PUFs) practical and scalable for highly constrained IoT, automotive, and edge AI applications.
At the core of this advancement is Crypto Quantique’s new QDID architecture, which introduces a breakthrough reduction in the "helper data" required for error correction. By tightly coupling this architecture with I-fuse® OTP, the integrated solution delivers two critical benefits:
- Minimal Silicon Footprint: By drastically reducing the volume of helper data required, customers can utilise a much smaller OTP storage footprint. This preserves valuable silicon area and reduces overall costs while maintaining a highly compact, side-channel attack resilient PUF.
- Zero-Overhead Integration: The solution securely generates, stores, and manages helper data entirely within the PUF. Because this is completely abstracted from the end user, developers can integrate a robust root-of-trust without having to manage complex provisioning, initialisation, or lifecycle handling.
For customers requiring the convenience of a solution compatible with a digital P/R flow with a smaller footprint, Crypto Quantique also offers a fully digital PUF IP, which requires less than 30K gates including the entropy source and associated error correction for generating an immutable seed. The lightweight implementation of the seed generation IP, comprising of Crypto Quantique’s Digital PUF, error correction and the helper data storage is greatly simplified for the SoC integrator with the integration of the Attopsemi’s I-fuse® OTP.
Attopsemi’s I-fuse® OTP complements Crypto Quantique’s PUF IP with a highly reliable, silicon-proven non-volatile memory solution featuring a patented fuse structure and heat-assisted electromigration programming. Its small footprint, low voltage operation, make it an ideal companion for next-generation secure devices at the TSMC 12nm node.

Figure 1: Quantum Entropy-source PUF generating multiple seeds and packaged with associated OTP for reduced helper data

Figure 2: Digital PUF with smaller entropy source for single seed and associated OTP bank for helper data
Together, the technologies enable semiconductor companies to deploy secure device identity and seed generation with unprecedented ease. The combined solution reduces design complexity, shortens time-to-market, and lowers total system cost, while simultaneously increasing security assurance.
Shahram Mossayebi, CEO of Crypto Quantique, said: “This collaboration with Attopsemi demonstrates how far PUF technology has evolved. With our latest QDID architecture, we have dramatically reduced helper data requirements, making PUF integration simpler and more efficient than ever. When combined with Attopsemi’s OTP, this creates a seamless, low-footprint root-of-trust solution that removes barriers for semiconductor designers and accelerates adoption across multiple markets.”
Roger Cheng, CEO of Attopsemi, added: “Our I-fuse® OTP is the crown jewel of OTP technologies with extremely high reliability and low program voltage that can achieve very small size without charge pumps and redundancy. Our partnership with Crypto Quantique highlights the strength of combining best-in-class OTP with cutting-edge PUF innovation. The reduced helper data requirement of QDID allows customers to minimise OTP usage while achieving high levels of security and reliability. This is a significant advancement for developers building secure IoT and automotive systems.”
The joint solution is available for integration in devices manufactured on TSMCs advanced 12nm CMOS process, enabling scalable deployment across a wide range of applications.
Explore PUF IP:
About Crypto Quantique
Crypto Quantique (CQ) is an award-winning cybersecurity company providing end-to-end device security, combining software and silicon hardware IP. The company works closely with semiconductor and system companies to develop robust security architectures for ASICs, MCUs, and complex SoCs. Crypto Quantique is headquartered in London, UK, with operations across the US, Europe, and Asia.
About Attopsemi Technology
Attopsemi Technology is a leading provider of fuse-based OTP IP headquartered in Hsinchu, Taiwan. Since 2010, the company has specialised in delivering high-reliability, low-power OTP solutions across a wide range of CMOS technologies, from mature nodes to advanced FinFET processes. Its I-fuse® OTP is widely adopted in automotive, IoT, and high-performance semiconductor applications.
Related Semiconductor IP
- PUF IP
- Digital PUF IP
- PUF FPGA-Xilinx Premium with key wrap
- ASIL-B Ready PUF Hardware Premium with key wrap and certification support
- ASIL-B Ready PUF Hardware Base
Related News
- Crypto Quantique teams up with Attopsemi to simplify the implementation of PUF technology in MCUs and SoCs
- Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology
- Crypto Quantique adds TRNG to its quantum-derived, side-channel protected PUF hardware IP block
- Attopsemi Scales I-fuse® Technology to 7nm FinFET following 12nm Silicon Success
Latest News
- Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem