TSMC gets nod for 130-nm production in China
Mark LaPedus, EETimes
9/30/2010 1:21 PM EDT
SAN JOSE, Calif. - The Taiwan government has approved Taiwan Semiconductor Manufacturing Co. Ltd.'s application to upgrade its 200-mm fab in Shanghai, China to 0.13-micron technology, according to a report from Reuters.
In the past, TSMC was limited to 0.25-micron processes in China by the Taiwan government. Then, the rules were relaxed to 0.18-micron processes in the fab.
Fair or not, the Taiwan government wants to keep leading-edge chip production on the island.
To read the full article, click here
Related Semiconductor IP
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
Related News
- TSMC weighs pain versus gain in 130-nm technology
- Faraday Expands Free Library Offerings for UMC's 130nm (0.13-micron) Logic Process
- Nurlogic moves libraries to IBM 130-nm foundry process
- SilTerra to Provide Virage Logic's IPrima(TM) Foundation Platform to Its 130nm Process Customers
Latest News
- CAST Introduces MAC-SEC-MG IP Core for Secure 10G+ Ethernet SoC Designs
- Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory