Texas Instruments opens the company's first semiconductor manufacturing plant in China
Chengdu fab puts manufacturing close to growing customer base in China
CHENGDU, China, Oct. 14, 2010 -- Texas Instruments Incorporated (NYSE: TXN) (TI) today announced its first wafer fabrication facility, or "fab," in China. This important milestone puts manufacturing close to the company's growing customer base there. Located in the Chengdu High-tech Zone (CDHT), which is considered by many to be China's next major technology hub, TI Chengdu will further expand TI's analog production capacity.
The fab is a fully equipped 200mm manufacturing facility and was purchased from Cension Semiconductor Manufacturing Company. It includes an operating 120,000-square- foot fab that can support more than $1 billion in annual revenue and a 134,000-square-foot fab reserved for future production needs.
"TI has been committed to serving the China market for 25 years," said Gregg Lowe, TI senior vice president for Analog. "Increasingly, customers there are using TI's analog chips for the real-world functions in their electronic applications. This fab in Chengdu will strengthen our ability to support customers' growing requirements and deliver analog products when and where customers need them."
This announcement follows TI manufacturing expansions in the U.S., Japan and Germany over the past 24 months.
For more information about TI delivery capacity and analog manufacturing investments, please see www.ti.com/chengdu-pr.
About Texas Instruments
Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries. For more information, go to www.ti.com.
Related Semiconductor IP
- xSPI Multiple Bus Memory Controller
- MIPI CSI-2 IP
- PCIe Gen 7 Verification IP
- WIFI 2.4G/5G Low Power Wakeup Radio IP
- Radar IP
Related News
- SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab
- Huawei planning on using SMIC to fab 7nm ICs this year
- Palm to base next-generation wireless units on TI platform
- TI wraps DSP/RISC combo with RTOS support
Latest News
- Premier ASIC and SoC Design Partner, Sondrel, Rebrands as Aion Silicon
- Intel Financial Risks, Layoffs, Foundry Ambitions
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
- China Takes the Lead in RF Front-End Patent Activity: RadRock and Others Surge Behind Murata
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®