DCD-SEMI Joins MIPI Alliance and Unveils Latest I3C IP at MIPI Plugfest Warsaw 2025

June 18, 2025 -- DCD-SEMI, a leading provider of customizable IP cores and system-on-chip solutions, proudly announces its official membership in the MIPI Alliance, a global organization that develops interface specifications for mobile and mobile-influenced industries.

Joining MIPI Alliance marks a significant step in DCD-SEMI’s commitment to delivering industry-compliant, high-performance IP cores to its global customers. As part of this initiative, DCD-SEMI will showcase its latest I3C IP core during the upcoming MIPI Plugfest, held in Warsaw on June 23-24, 2025.

The new I3C IP core from DCD-SEMI is designed to deliver enhanced performance, lower power consumption, and simplified integration for next-generation embedded systems. Developed in line with the MIPI I3C® specification, the IP core supports seamless sensor integration and offers backward compatibility with I²C, making it ideal for use in consumer electronics, automotive, industrial, and medical applications.

“We’re excited to become a part of the MIPI Alliance and contribute to the development of globally adopted interface standards,” said Jacek Hanke, CEO of DCD-SEMI. “Our latest I3C IP core is a result of close alignment with the MIPI specification and offers unmatched flexibility and configurability for SoC and FPGA-based solutions.”

The MIPI Plugfest in Warsaw will provide a unique opportunity for DCD-SEMI to demonstrate the interoperability and robustness of its I3C IP in real-world test scenarios, alongside other industry leaders and MIPI members.

For more information about DCD-SEMI’s I3C IP visit the product page: https://www.dcd.pl/product/di3cm-hci/