Chips&Media Joins TSMC's Soft-IP Alliance Program

Seoul, Korea. – October 12, 2010 - Chips&Media, Inc., a leader in silicon video Intellectual Property (IP), today announces that it has joined the newly announced TSMC Soft-IP Alliance Program included in TSMC’s Open Innovation Platform™, as a soft-IP core provider.

Chips&Media can deliver power, performance and area optimized IP for video processing through the program, in which TSMC is expected to provide specific technology information including standard cell libraries across TSMC technology nodes. Chips&Media will also help SoC customers to create value-added products with the ultimate aim of significantly reducing development time, cost and risk.

“Chips&Media is pleased to enter the TSMC soft-IP Alliance Program to contribute next generation video codec technology.” says Mr. Steve Kim, president and CEO of Chips&Media,Inc. “We have led video IP industry with a wide range of differentiated video solutions for cost-sensitive, battery-powered devices including wireless, portable computing, advanced set-top-boxes and network-enabled applications, and through the TSMC Alliance Program we will be able to broaden our customer base as well as strengthen our product portfolio with TSMC’s advanced process technology roadmap.”

About Chips&Media

Chips&Media, Inc. is a leading video IP provider based in Seoul, Korea(Republic of). Chips&Media's video codec technologies cover the full line-up of video standards such as MPEG-2, MPEG-4, H.263, H.264/AVC, VC-1, RealVideo and AVS from D1 to Full HD resolution. Its advanced ultra-low power multi-codec video IP has been chosen by more than 40 top-tiers based in US, Europe, Korea, Taiwan, China and Japan and has been proven in silicon reaching 35 millions of units. For more information, please visit www.chipsnmedia.com