Broadcom lays off 1,100; may lay off more
“Management is in the process of further evaluating our resources and business needs and may eliminate additional positions, which would result in additional restructuring costs,” says the 10-Q regulatory filing in which Broadcom announced its lay-offs.
The current lay-off follows Broadcom’s $5.5 billion acquisition of Brocade in November.
To read the full article, click here
Related Semiconductor IP
- 0.9V/2.5V I/O Library in TSMC 55nm
- 1.8V/3.3V Multi-Voltage GPIO in TSMC 28nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- ESD Solutions for Multi-Gigabit SerDes in TSMC 28nm
- High-Speed 3.3V I/O library with 8kV ESD Protection in TSPCo 65nm
Related News
- Arm China lays off 14% of staff
- Altera kicks off mask-programmable PLD program
- Vendors square off for DDR chip set competition
- MIPS Technologies kicks off new alliance program giving 32- and 64-Bit designers key tools and applications
Latest News
- BrainChip Partners with RTX’s Raytheon for AFRL Radar Contract
- Movellus and RTX’s SEAKR Engineering Collaborate on Advancing Mission-Critical ASICs
- DARPA Selects Cerebras to Deliver Next Generation, Real-Time Compute Platform for Advanced Military and Commercial Applications
- Rapidity Space to Demonstrate Performance Capabilities of the GR765 Platform with SIMD Support
- Telestream Integrates intoPIX’s JPEG XS Technology into PRISM for Advanced IP Video Monitoring