Broadcom lays off 1,100; may lay off more
“Management is in the process of further evaluating our resources and business needs and may eliminate additional positions, which would result in additional restructuring costs,” says the 10-Q regulatory filing in which Broadcom announced its lay-offs.
The current lay-off follows Broadcom’s $5.5 billion acquisition of Brocade in November.
To read the full article, click here
Related Semiconductor IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
- SHA-256 Secure Hash Algorithm IP Core
- EdDSA Curve25519 signature generation engine
Related News
- Arm China lays off 14% of staff
- Altera kicks off mask-programmable PLD program
- Vendors square off for DDR chip set competition
- MIPS Technologies kicks off new alliance program giving 32- and 64-Bit designers key tools and applications
Latest News
- Cadence and Google Collaborate to Scale AI-Driven Chip Design with ChipStack AI Super Agent on Google Cloud
- Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums
- TES offers a High-Frequency Synthesizer and Clock Generator IP for X-FAB XT018 - 0.18µm BCD-on-SOI technology
- Faraday Delivers IP Solutions to Enable Endpoint AI Based on UMC’s 28nm SST eFlash
- AiM Future Partners with Metsakuur Company to Commercialize NPU-Integrated Hardware