Broadcom lays off 1,100; may lay off more
“Management is in the process of further evaluating our resources and business needs and may eliminate additional positions, which would result in additional restructuring costs,” says the 10-Q regulatory filing in which Broadcom announced its lay-offs.
The current lay-off follows Broadcom’s $5.5 billion acquisition of Brocade in November.
To read the full article, click here
Related Semiconductor IP
- USB 20Gbps Device Controller
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
- AGILEX 7 R-Tile Gen5 NVMe Host IP
- 100G PAM4 Serdes PHY - 14nm
Related News
- Arm China lays off 14% of staff
- Altera kicks off mask-programmable PLD program
- Vendors square off for DDR chip set competition
- MIPS Technologies kicks off new alliance program giving 32- and 64-Bit designers key tools and applications
Latest News
- Qualitas Semiconductor Successfully Demonstrates Live UCIe PHY IP at AI Infra Summit 2025
- Silicon Creations Announces 1000th Production FinFET Tapeout at TSMC and Immediate Availability of Full IP Library on TSMC N2 Technology
- Intel and NVIDIA to Jointly Develop AI Infrastructure and Personal Computing Products
- Comcores MACsec IP is compliant with the OPEN Alliance Standard
- Sofics joins GlobalFoundries’ GlobalSolutions Ecosystem to Enhance Chip Robustness, Performance and Design Efficiency