New Tensilica Fusion DSP Sets Low-Energy Benchmarks for IoT, Wearables and Wireless Connectivity 2015-04-22 23:43:00 SoC Architecture & Assembly
New Tensilica Fusion DSP Sets Low-Energy Benchmarks for IoT, Wearables and Wireless Connectivity 2015-04-22 17:17:00 IP Cores & Design
Arteris Delivers FlexNoC Physical Interconnect IP to Accelerate SoC Layout 2015-04-22 16:55:00 IP Cores & Design
Gartner Says Worldwide Semiconductor Sales Expected to Reach $354 Billion in 2015, a 4 Percent Increase from 2014 2015-04-22 13:12:00 Analysis & Insight
North American Semiconductor Equipment Industry Posts March 2015 Book-to-Bill Ratio of 1.10 2015-04-22 07:32:00 Analysis & Insight
S2C Sets New Standards For FPGA-Based Prototyping With Prodigy Complete Prototyping Platform 2015-04-21 16:03:00 Misc
Synopsys' Modeling of 10-nanometer Parasitic Variation Effects Ratified by Open-Source Standards Board 2015-04-21 15:31:00 EDA & Design Tools
UltraSoC announces industry-first "debug over USB" capability for complex SoCs 2015-04-21 15:25:00 SoC Architecture & Assembly
Global Semiconductor Market Achieves Strong, Broad-based Growth in 2014, According to IHS 2015-04-20 16:20:00 Analysis & Insight
Athena and Rambus Cryptography Research Division Announce Solutions to Prevent Advanced Security Threats 2015-04-20 14:16:00 IP Cores & Design
Netspeed Systems Accelerates Global Adoption of its On-Chip Network IP with new Office in Tokyo 2015-04-20 10:28:00 Strategic Partnerships
Comcores announces availability of an ETIS ORI 4.1.1 compliant CPRI IQ Compression IP Core enabling enhanced throughput or lowering of front-haul cost in wireless networks 2015-04-20 08:40:00 IP Cores & Design