TSMC N3E 1.5V LVDS
Synopsys Low Voltage Differential Signaling (LVDS) IO library is a high-frequency interface that uses differential signals for da…
Overview
Synopsys Low Voltage Differential Signaling (LVDS) IO library is a high-frequency interface that uses differential signals for data transmission. A few typical LVDS IO applications are in display monitors, printers, high-speed clock transfers, and high-speed SERDES. Synopsys LVDS IO library is used to build an LVDS-based interface for high-speed interconnect applications. This library is designed to optimize IO performance with a core voltage of 0.75 V and supports an IO supply voltage of 1.2V/1.5 V. The library contains a transmitter, a receiver, and a bandgap reference circuit that is used to supply the current reference for the transmitter/receiver. The LVDS IO library is compatible with the IEEE standard 1596.3-1996 and TIA/EIA - 644 -A.
Key features
- Maximum operating speed: up to 3.4GBPS
- Compatibility with TIA/EIA - 644-A for greater interoperability
- Loop back option supported for both Pre/Post driver in LVDS TX
- HBM 2KV, CDM 500V (up to 7A)
- Silicon validated IP
- Automotive G1/G2 supported, ASIL-B certified
- Designed to support multiple metal stack options
- Support for flip-chip & wirebond packaging
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 3nm | N3E | — |
Specifications
Identity
Files
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Provider
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Frequently asked questions about High-Speed I/O Pad IP
What is TSMC N3E 1.5V LVDS?
TSMC N3E 1.5V LVDS is a High-Speed IP core from Synopsys, Inc. listed on Semi IP Hub. It is listed with support for tsmc.
How should engineers evaluate this High-Speed?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.