Vendor:
Global UniChip Corp. (GUC)
Category:
Custom
TSMC CLN5FF GLink 2.0 Die-to-Die PHY
IGPD2DY01A is a high-speed Die-to-Die interface PHY that transmits data through TSMC packaging solutions: Integrated Fan-Out (InF…
Overview
IGPD2DY01A is a high-speed Die-to-Die interface PHY that transmits data through TSMC advanced packaging solutions: Integrated Fan-Out (InFO) with RDL interconnect and Chip-on-Wafer-on-Substrate (CoWoS®) with silicon interposer. IGPD2DY01A contains 32 TX lanes and 32 RX lanes per slice and supports 8 slices in one PHY. Each TX/RX lane can support up to 16 Gbps data rate. In summary, IGPD2DY01A offers a full-duplex data transmission with extremely low power and up to 512 Gbps data rate per slice in both directions.
Each TX/RX slice contains PMA and PCS modules. PMA supports serialization, de-serialization, data transmission, eye training, and lane repair functions. PCS provides data bus inversion, CRC/Parity check, and FIFO functions. One PLL is also included in IGPD2DY01A to generate an 8 GHz high-speed clock for data transmission.
IGPD2DY01A is designed and fabricated in TSMC 5 nm FF CMOS process with 1.2 V analog supply voltage for PLL/PMA and 0.75 V analog/digital supply voltages. Independent low power mode for PLL and slices is available.
Each TX/RX slice contains PMA and PCS modules. PMA supports serialization, de-serialization, data transmission, eye training, and lane repair functions. PCS provides data bus inversion, CRC/Parity check, and FIFO functions. One PLL is also included in IGPD2DY01A to generate an 8 GHz high-speed clock for data transmission.
IGPD2DY01A is designed and fabricated in TSMC 5 nm FF CMOS process with 1.2 V analog supply voltage for PLL/PMA and 0.75 V analog/digital supply voltages. Independent low power mode for PLL and slices is available.
Key features
- 32 full-duplex lanes per slice
- 8 slices are included in the analog hard macro
- 1:8 mode with 256-bit data width or 1:16 mode with 512-bit data width for user interface
- VALID and READY handshake mechanism
- Flow control between TX and RX
- Data bus inversion
- CRC/Parity check
- Data replay to ensure no error found in RX
- Programmable data scrambling for smoothing current consumption profile
- Built-in test pattern and checker
- Lane repair
- EHOST: APB3, I2C, and JTAG register interface
- Built-in PLL
- 0.308 pJ/bit power consumption
- 1.2 V analog supply voltage for PLL/PMA and 0.75 V analog/digital supply voltage
- Independent low power mode for analog blocks
- Operating junction temperature: -40 °C ~ 125 °C
- Process: TSMC 5 nm 0.75 V/1.2 V CMOS LOGIC FinFET Process
- Metal Scheme: 1P15M (1X_h_1Xb_v_1Xe_h_1Ya_v_1Yb_h_5Y_vhvhv_2Yy_2R)
- 1P16M (1X_h_1Xb_v_1Xe_h_1Ya_v_1Yb_h_4Y_vhvh_2Yy_2Yx_2R)
- 1P17M (1X_h_1Xb_v_1Xe_h_1Ya_v_1Yb_h_5Y_vhvh_2Yy_2Yx_2R)
- Analog hard macro size: 3048.576 um x 744.968 um (2.271 mm2) for North-South direction macro and
- 746.283 um x 3047.268 um (2.274 mm2) for East-West direction macro
- Logic gate count: 2.8 M
- Supports both horizontal and vertical GDS orientation
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 5nm | N5FF | Available on request |
Specifications
Identity
Part Number
IGPD2DY01A
Vendor
Global UniChip Corp. (GUC)
Type
Silicon IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
Taiwan
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Frequently asked questions about Custom Die-to-Die IP cores
What is TSMC CLN5FF GLink 2.0 Die-to-Die PHY?
TSMC CLN5FF GLink 2.0 Die-to-Die PHY is a Custom IP core from Global UniChip Corp. (GUC) listed on Semi IP Hub. It is listed with support for tsmc Available on request.
How should engineers evaluate this Custom?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Custom IP.
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