Simplifying Multi-Domain Voltage-Control Verification with Synopsys AVSBus 2.0 VIP
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Vendor:
Synopsys, Inc.
Category:
High-Speed
TSMC 3nm (N3E) 1.8V SD/eMMC IO
Synopsys SD/eMMC PHY provides an optimal balance for cost and performance for storage solutions.
Overview
Synopsys SD/eMMC PHY provides an optimal balance for cost and performance for storage solutions. Synopsys SD/eMMC PHY is a hard IP that can be used to implement a single interface that can accomplish 4-bit, 8-bit eMMC & 4-bit SD operations. It includes an optional digi logic circuitry which is required for high-speed operations. It complies with eMMC 5.1 (JESD84-B51A) and SDIO 6.0 JEDEC standards.
Key features
- Completely hardened PHY solution along with programmable delay chains & I/Os
- Fully selectable output impedance
- Compliant with eMMC 5.1 (JESD84-B51A) and SDIO 3.0 JEDEC Standard
- Automotive G1/G2 supported, ASIL-B certified
- Interoperability checks done with Synopsys Controllers
- HBM 2KV, CDM 500V(up to 7A), Latch-up +/-100 mA @ 125C
- Silicon validated IP
- Designed to support multiple metal stack options
- Support for flip-chip & wirebond packaging
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 3nm | N3E | — |
Specifications
Identity
Part Number
dwc_io_ts3ffe_1p8v_emmc_sd_io
Vendor
Synopsys, Inc.
Type
Silicon IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
USA
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Frequently asked questions about High-Speed I/O Pad IP
What is TSMC 3nm (N3E) 1.8V SD/eMMC IO?
TSMC 3nm (N3E) 1.8V SD/eMMC IO is a High-Speed IP core from Synopsys, Inc. listed on Semi IP Hub. It is listed with support for tsmc.
How should engineers evaluate this High-Speed?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.