Vendor: Certus Semiconductor Category: High-Speed

Multi-Standard Multi-Voltage Fail-Safe I/O in DB HiTek 110nm

A Specialized 1.2V to 3.3V Fail-Safe GPIO in Dongbu HiTek 110nm 11SB Pro- cess, with multiple protocol capabilties.

DB HiTek 110nm SB View all specifications

Overview

A Specialized 1.2V to 3.3V Fail-Safe GPIO in Dongbu HiTek 110nm 11SB Pro- cess, with multiple protocol capabilties.

This silicon-proven Wirebond compatible library in Dongbu HiTek 110nm features a multi-voltage, multi-standard General Purpose Input Output with an Open-Drain Input Output capability, that targets the I2C standard. The library is built as a Fail- Safe I/O design. There is no poly-orientation for this library. The library features an Analog Mux, which allows for core direct access to the bondpad, either to drive externally a signal or receive a signal from the PAD. The I/O Library is compliant with standards regarding all 1.2V, 1.8V, and 3.3V operation. The library can support various standards, including I3C, I2C, SPI and QSPI. ESD targets are 2kV HMB and 500V CDM.

 Operating Conditions

Parameter Value
Devices 3.3V Thick & 1.2V Thin Oxides
BEOL 1P7M
VDDIO 1.2V, 1.8V or 3.V
VDD 1.2V
Temp -40C to 125C
ESD 2kV HBM & 500V CDM
I/O Cell Size 100x200um
Bondpad 70x70um

Cell Summary

  • DN_GPODIIC: An FS-GPIO/FS-ODIO with I2C targeted performance, and a broad selection of slew rate for the GPIO feature.
  • DN_GPOD: An FS-GPIO/FS-ODIO designed for high-speed, hard driving applications. No slew rate features.

Key features

  •  Open-Drain Pull-up and Pull-down resistors
  •  Selectable Pull-up and Pull-down resistors
  •  Schmitt Trigger Input Reciever
  •  Selectable Drive Strengths (GPIO and ODIO modes) 
  •  Selectable Slew Rates (GPIO and ODIO modes)
  • Fail-Safe (I/O leaks zero current at pad when VDDIO is   powered down)
  • Analog Mux Feature
  • Power-down control
  • Wide   Capacitive   Load  Range:    10pF   to 75pF  GPIO,   300pF ODIO
  • Wide Slew Rate Select Ranges: 0.5pS to 100nS
     

Block Diagram

Silicon Options

Foundry Node Process Maturity
DB HiTek 110nm SB —

Specifications

Identity

Part Number
DN110
Vendor
Certus Semiconductor
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

HQ: United States

Learn more about High-Speed IP core

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Field Induced CDM Explained

Integrated circuits are commonly tested for ESD robustness with 2 tests, Human Body Model (HBM) and Charged Device Model (CDM). Most engineers quickly grasp the procedure for HBM, but the CDM test is often poorly understood. This is unfortunate, because a large fraction of the ESD failures experienced in modern board assembly operations are CDM type failures. This article will describe the events which occur during a CDM test conducted using the widely accepted field induced CDM (FCDM) test.

One Platform, Five Libraries: Certus Semiconductor’s I/O IP Portfolio for Every Application on TSMC 22nm ULL/ULP Technologies

Certus Semiconductor’s I/O libraries for TSMC’s 22nm ultra-low leakage (22ULL) and 22nm ultra-low power (22ULP) technologies offer robust, high-performance solutions tailored to a wide range of SoC designs — from ultra-low power IoT nodes to demanding consumer and automotive systems. Whether you need low leakage, high drive strength, or analog compatibility, our production-proven IP covers it all.

Frequently asked questions about High-Speed I/O Pad IP

What is Multi-Standard Multi-Voltage Fail-Safe I/O in DB HiTek 110nm?

Multi-Standard Multi-Voltage Fail-Safe I/O in DB HiTek 110nm is a High-Speed IP core from Certus Semiconductor listed on Semi IP Hub. It is listed with support for dbhitek.

How should engineers evaluate this High-Speed?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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