Simulation VIP for AMBA CHI-C2C
Best-in-class Arm® AMBA® CHI-C2C Verification IP (VIP) for your IP, SoC, and System-level Design Testing Cadence provides a matur…
Accelerated confidence in simulation-based verification of RTL designs with Compute Express Link (CXL) interfaces: CXL1, CXL2, CX…
Our mass production-proven IPTD2D-A D2D Interconnect IP Solutions offer industry- power efficiency, performance, and low latency,…
The second-generation high-performance RISC-V CPU delivers a major leap in compute capability, designed for deployment across dat…
Comprehensive memory model and PHY verification HBM VIP is a comprehensive memory VIP solution portfolio for high bandwidth memor…
Accelerated confidence in simulation-based verification of RTL designs with Ethernet networking interfaces Avery TSN Ethernet Ver…
UCIe-S PHY for Standard Package (x32) in TSMC (N3P)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-S PHY for Standard Package (x16) for Automotive in TSMC (N5A)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in Samsung (SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in TSMC (N5)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
UCIe-A PHY for Advanced Package (x64) in Samsung (SF4X)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…
Synopsys 3DIO IP Solution is a specialized IO for multi-die integration.
TSMC N3P Source Sync 3DIO Library
Synopsys 3DIO IP Solution is a specialized IO for multi-die integration.
Synopsys 3DIO IP Solution is a specialized IO for multi-die integration.
TSMC N5 Source Sync 3DIO Library
Synopsys 3DIO IP Solution is a specialized IO for multi-die integration.
Synopsys 3DIO IP Solution is a specialized IO for multi-die integration.
Synopsys 3DIO IP Solution is a specialized IO for multi-die integration.
Neoverse Compute Subsystems N3 (CSS N3)
The Performance-per-Watt Arm Neoverse N3 Platform Validated by Arm for Networking and Edge Markets configurable to target 5G, DPU…
Neoverse Compute Subsystems V3 (CSS V3)
The High-Performance Arm V3 Platform Performance-Optimized and Validated by Arm Arm Neoverse CSS V3 is the fastest path to buildi…
UCIe-A PHY for Advanced Package (x64) in TSMC (N7, N6, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data c…