Vendor: Aragio Solutions Category: High-Speed

RGMII IO Pad Set

The (R)GMII libraries provide the combo driver / receiver and required support cells for (R)GMII signaling.

TSMC 16nm Silicon Proven View all specifications

Overview

The (R)GMII libraries provide the combo driver / receiver and required support cells for (R)GMII signaling. The libraries are compliant with the
Gigabit Media Independent Interface (GMII) specified in IEEE 802.3- 2005. They are also compliant with the Reduced Gigabit Media
Independent Interface (RGMII) specification defined by HP (RGMII, version 1.3, 12/10/2000). These libraries are offered as a supplement to
the I/O libraries provided by Aragio Solutions.

What’s Included?

  • Final deliverables for the Licensed Product do not include test chip,
  • silicon verification and characterization results, but shall include:
  • a. Physical abstract in LEF format (.lef)
  • b. Timing models in Synopsys Liberty formats (.lib and .db)
  • c. Calibre compatible LVS netlist in CDL format (.cdl)
  • d. GDSII stream (.gds)
  • e. Behavioral Verilog (.v)
  • f. Layout Parasitic Extraction (LPE) SPICE netlist (.spice)
  • g. Databook (.pdf)
  • h. Library User Guide - ESD Guidelines (.pdf)

Silicon Options

Foundry Node Process Maturity
TSMC 16nm 16nm 160 nm Silicon Proven

Specifications

Identity

Part Number
RGO_TSMC16_18V33_FFC_20C_RGMII
Vendor
Aragio Solutions
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

Learn more about High-Speed IP core

Frequently asked questions about High-Speed I/O Pad IP

What is RGMII IO Pad Set?

RGMII IO Pad Set is a High-Speed IP core from Aragio Solutions listed on Semi IP Hub. It is listed with support for tsmc Silicon Proven.

How should engineers evaluate this High-Speed?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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