Vendor: SMIC Category: High-Speed

SMIC 130nm G SSTL18 IO

SMIC 130nm G Silicon Proven View all specifications

Key features

  • SMIC 0.13um Logic 1P8M Salicide 1.2V/2.5V Process;
  • Suitable for 6,7 and 8 layers application;
  • SSTL18 IO compatible with SP013

Silicon Options

Foundry Node Process Maturity
SMIC 130nm G Silicon Proven

Specifications

Identity

Part Number
SP013_SSTL18
Vendor
SMIC
Type
Silicon IP

Provider

HQ: China

Learn more about High-Speed IP core

SMIC Reports 2025 Second Quarter Results

SMIC, one of the leading semiconductor foundries in the world, today announced its consolidated results of operations for the three months ended June 30, 2025.

SMIC Reports 2024 Second Quarter Results

SMIC today announced its consolidated results of operations for the three months ended June 30, 2024. Revenue was $1,901.3million in 2Q24, compared to $1,750.2 million in 1Q24, and $1,560.4 million in 2Q23.

SMIC Reports 2023 Fourth Quarter Results

SMIC today announced its consolidated results of operations for the three months ended December 31, 2023. Revenue was $1,678.3million in 4Q23, compared to $1,620.6 million in 3Q23, and $1,621.3 million in 4Q22.

SMIC Reports 2023 Third Quarter Results

SMIC" today announced its consolidated results of operations for the three months ended September 30, 2023. Revenue was $1,620.6 million in 3Q23, compared to $1,560.4 million in 2Q23, and $1,907.0 million in 3Q22.

Frequently asked questions about High-Speed I/O Pad IP

What is SMIC 130nm G SSTL18 IO?

SMIC 130nm G SSTL18 IO is a High-Speed IP core from SMIC listed on Semi IP Hub. It is listed with support for smic Silicon Proven.

How should engineers evaluate this High-Speed?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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