Vendor: Key ASIC Category: High-Speed

LVDS IO handling data rate up to 50Mbps with maximum loading 60pF

KA16UGLVDS01ST001 is a LVDS IO handling data rate up to 50Mbps with a maximum loading of 60pF.

Overview

KA16UGLVDS01ST001 is a LVDS IO handling data rate up to 50Mbps with a maximum loading of 60pF. The differential voltage swing can be programmable from 0.35V to 1V. The output enable control function can be activated to decide the IO as input/output function. This IP also includes the IO PAD.

Key features

  • Process: Silterra 0.16um CMOS 1P5M Process
  • Supply Voltage Range: AVDD33 = 3.3v +/-10%, AVDD18 = 1.8v +/-10%
  • Ambient Temperature: 0°C~80°C
  • Compatible with BLVDS_25 of Spartan-3A FPGA
  • Bi-direction (half-duplex)
  • External Termination Resistor: RT = 120Ω
  • Maximum Running Data Rate 50 Mbps with Maximum Loading 60pF
  • <3-bit> Programmable Output Differential Voltage from 0.35V to 1V
  • ESD: 2kV HBM and 200V MM

Block Diagram

Benefits

  • The differential voltage swing can be programmable from 0.35V to 1V.

Applications

  • Consumer
  • Industrial Electronic

What’s Included?

  • Compatible with BLVDS_25 of Spartan-3A FPGA

Specifications

Identity

Part Number
KA16UGLVDS01ST001
Vendor
Key ASIC
Type
Silicon IP

Provider

HQ: Malaysia

Learn more about High-Speed IP core

Securing SoC Reliability with Precision Power-On Reset IP for 0.8V Industrial Designs

As process nodes continue to shrink and core voltages drop to around 0.8V, the margin for noise in logic levels has become extremely small. Traditional RC-based reset circuits simply don’t have the precision needed to reliably tell the difference between a normal power-up sequence and a risky voltage fluctuation. That’s where Key ASIC’s Integrated Power-On Reset (POR) IP comes in.

A Systematic Approach to Robust LVDS Integration in Advanced Node ASICs

Across the semiconductor industry, a great deal of attention is currently directed toward 112G SerDes and next-generation memory interfaces like DDR5. These developments are important to meet the growing demand for high-speed interfaces, but veteran SoC engineers who have taken over 100 designs into mass production often see the picture differently.

Why 6.4 Gbps DDR5 Designs Fail and How to Avoid It

As we push beyond the 6.4 Gbps threshold with DDR5, the margin for error has essentially disappeared. For engineering leads and decision-makers, the goal is no longer just a simulation that looks functional. What we really need is First-Pass Silicon Success—a stable, high-yield product that works right from the very first tape-out.

Three Ethernet Design Challenges in Industrial Automation

As factories, process plants, and robotics platforms become increasingly intelligent and interconnected, the demand for stable, low-latency data links has pushed Ethernet deeper into embedded systems. However, since designing Ethernet connectivity into industrial chips comes with its technical and logistical hurdles, engineers may face challenges when implementing Ethernet in industrial designs.

Maximizing SoC Longevity with PCIe 3.0: A Designer’s Guide

As PCIe 5.0 and 6.0 dominate headlines in the semiconductor industry, it’s tempting for every SoC design team to reach for the newest protocol available. But not every application needs blazing-fast 32GT/s throughput—and not every market segment can afford the power, complexity, and cost penalties that come with bleeding-edge PHYs.

Frequently asked questions about High-Speed I/O Pad IP

What is LVDS IO handling data rate up to 50Mbps with maximum loading 60pF?

LVDS IO handling data rate up to 50Mbps with maximum loading 60pF is a High-Speed IP core from Key ASIC listed on Semi IP Hub.

How should engineers evaluate this High-Speed?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

×
Semiconductor IP