Vendor: NTLab Category: PLL

Programmable CMOS PLL high-frequency divider

The CMOS PLL high-frequency divider consists of the converter of a differential input signal to an unipolar signal with a supply …

TSMC 180nm BCDG2 Silicon Proven View all specifications

Overview

The CMOS PLL high-frequency divider consists of the converter of a differential input signal to an unipolar signal with a supply voltage peak-to-peak, a prescaler with variable dividing ratio 8/9 and two binary decade counters.
The block is fabricated on TCMS BiCMOS 0.18 um technology.

Key features

  • TCMS BiCMOS 0.18 um
  • Wide range of dividing ratio (56…2047)
  • Low current consumption
  • Compact structure
  • Wide range of operating frequency - up to 5 GHz
  • Portable to other technologies (upon request)

Block Diagram

Applications

  • PLL frequency synthesizer

What’s Included?

  • Schematic or NetList
  • Abstract model (.lef and .lib files)
  • Layout view (optional)
  • Behavioral model (Verilog)
  • Extracted view (optional)
  • GDSII
  • DRC, LVS, antenna report
  • Test bench with saved configurations (optional)
  • Documentation

Silicon Options

Foundry Node Process Maturity
TSMC 180nm BCDG2 Silicon Proven

Specifications

Identity

Part Number
180TSMC_NDIV_02
Vendor
NTLab
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

HQ: Lithuania

Learn more about PLL IP core

Frequently asked questions about PLL IP cores

What is Programmable CMOS PLL high-frequency divider?

Programmable CMOS PLL high-frequency divider is a PLL IP core from NTLab listed on Semi IP Hub. It is listed with support for tsmc Silicon Proven.

How should engineers evaluate this PLL?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this PLL IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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