Vendor: T2M GmbH Category: Multi-Protocol PHY

PCIe 3.1 Serdes PHY IP, Silicon Proven in TSMC 28HPCP

(PCIe 3.1) x4 PHY IP supports PCIe3.1 transmission.

TSMC 28nm HPC+ In Production View all specifications

Overview

(PCIe 3.1) x4 PHY IP supports PCIe3.1 transmission. This is compliant with PCIe Rev3 Base Specification with support of PIPE 4.3 interface spec. Input clock frequency as 25Mhz, the output data rate(serial) supports all three 2.5 Gbps, 5.0 Gbps, 8.0 Gbps. 10 Pads is required, and the max clock speed is 500MHz. Operating Voltage Range: - 0.99V-1.21V, typical=1.1V - 2.97V-3.63V, typical=3.3V

Key features

  • Support PHY interface (PIPE4.3) enables multiple IP sources for USB3 MAC layer
  • Supports 5.0Gbps and 10Gbps serial data transmission rate Supports 16-bit or 32-bit parallel interface Data and clock recovery from serial stream
  • Support 8b/10b encoder/decoder(5Gbps), 128/130 encoder/decoder(BGbps) and error indication
  • Tunable receiver detection to detect worse case cables
  • Beacon transmission and reception
  • Support SSCG function to reduce EMI effects with tunable down-spread amplitude
  • Selectable TX margining, TX de-emphasis and signal swing values
  • Built-in-self-test with internal Loopback test option
  • Programmable analog circuit parameter adjustment and internal test control
  • Compliant with PCIe Rev3 base specification
  • Silicon Proven in TSMC 28HPC+

Benefits

  • Low Area
  • Low Power
  • Compliant with PCIe® 3.1, 2.1, 1.1, and PIPE specifications
  • PCIe PHY functionality is fully verifie

Applications

  • Notebooks
  • Smartphones
  • Tablets
  • Embedded mobile computing
  • Ultraportable laptops
  • Automotive
  • Mobile multimedia
  • Digital home
  • Digital office
  • Wireless connectivity

What’s Included?

  • Application Note / User Manual
  • Behavior model, and protected RTL codes
  • Protected Post layout netlist and Standard Delay Format (SDF)
  • Synopsys library (LIB)
  • Frame view (LEF)
  • Metal GDS (GDSII)
  • Test patterns and Test Documentation

Silicon Options

Foundry Node Process Maturity
TSMC 28nm HPC+ In Production

Specifications

Identity

Part Number
PCIe 3.1 Serdes PHY IP in 28HPCP
Vendor
T2M GmbH
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

HQ: Germany

Learn more about Multi-Protocol PHY IP core

How a 16Gbps Multi-link, Multi-protocol SerDes PHY Can Transform Datacenter Connectivity

Increasingly, more of the focus on mobile has centered around cloud datacenters and the networking to get the data back and forth between these datacenters and the mobile device. Functions like voice recognition and mapping depend on the ability to split the functionality between the smartphone, for local processing like encryption and compression, and the back end, where a large number of servers can do the heavier lifting before returning the results.

One PHY, Zero Tradeoffs: Multi-Protocol PHY for Edge AI Interface Consolidation

The Cadence 10G multi-protocol PHY was architected to address this exact challenge. Designed to scale across multiple process nodes, it consolidates PCI Express (PCIe), USB, DisplayPort, Ethernet, and other interfaces into a single, compact, silicon-efficient block. What sets it apart is simultaneous multi-protocol support, which enables multiple data paths without duplicating hardware, requiring extra board connectors, or paying the area and power penalty of separate IP blocks.

Frequently asked questions about Multi-Protocol PHY IP cores

What is PCIe 3.1 Serdes PHY IP, Silicon Proven in TSMC 28HPCP?

PCIe 3.1 Serdes PHY IP, Silicon Proven in TSMC 28HPCP is a Multi-Protocol PHY IP core from T2M GmbH listed on Semi IP Hub. It is listed with support for tsmc In Production.

How should engineers evaluate this Multi-Protocol PHY?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Multi-Protocol PHY IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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