Fully compliant with the DFI 4.0
- Controller + PHY
Memory interface IP cores provide the critical connectivity layer between processing elements and memory devices, enabling high-bandwidth, low-latency, and power-efficient data access in modern SoC, ASIC, AI, networking, and high-performance computing designs.
This category includes DDR, LPDDR, GDDR, HBM, NAND Flash, and NOR Flash interface IP solutions, covering memory controllers, PHYs, controller-PHY subsystems, training engines, calibration logic, and complete memory interface architectures. These IP cores are designed to maximize memory bandwidth, optimize latency, ensure signal integrity, and simplify integration across advanced semiconductor process nodes.
Fully compliant with the DFI 4.0
HBM2E Memory Controller
HBM2 Memory Controller
The LPDDR3 Controller gives you the ability to design with less power and a smaller form factor while maintaining high performanc…
Massive memory bandwidth, the simplicity of an AXI Interface, no need for external pins HBM IP, made available for Virtex UltraSc…
The Xilinx® LogiCORE™ IP HMC Controller implements a high performance, configurable HMC host controller for user to interconnect …
The RLD3 Controller gives you the ability to design for Reduced Latency DRAM while maintaining high performance and density.
The Xilinx DDR4 controller is high performance (2667Mbps in UItraScale+) and supports a wide range of configurations from low cos…
The Xilinx DDR3 controller is high performance (2133Mbps in UItraScale) with support for lower power DDR3L as well as UDIMMs, SOD…
compensation block for FXDDR3LTA102HH0L and FXDDR3LTD102HH0L,UMC 40nm LP/RVT LowK Logic Process .
compensation block for FXDDR3LTA102HH0L and FXDDR3LTD102HH0L,UMC 40nm LP/RVT LowK Logic Process .
Data Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant with DFI spec); UMC 40nm LP LowK Logic Proce…
Data Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm SP/RVT LowK Logic Process
Data Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm SP/RVT LowK Logic Process
Data Block of DDR3 Combo PHY for DIMM version ; UMC 55nm LP/RVT LowK Logic Process
Data Block of DDR3 Combo PHY for DIMM version ; UMC 55nm LP/RVT LowK Logic Process
Data Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process
Data Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process
DDR23 COMBO PHY Data Block ; UMC 40nm LP/RVT LowK Logic Process with 2.5V device (16Bit)
DDR23 COMBO PHY Data Block ; UMC 40nm LP/RVT LowK Logic Process with 2.5V device (16Bit)
DDR3/2 COMBO PHY DATA BLOCK for 2 layer 8 bits DDR3 PCB ; UMC 40LP/RVT LowK Logic Process with 2.5V device
DDR23 COMBO PHY Data Block ; UMC 40nm LP/RVT LowK Logic Process with 2.5V device
DDR23 COMBO PHY Data Block ; UMC 40nm LP/RVT LowK Logic Process with 2.5V device
DDR2/3 PHY Combo PHY data block (1.0v SP & 2.5V device); UMC 90nm SP/RVT LowK Logic Process
DDR2/3 PHY Combo PHY data block (1.0v SP & 2.5V device); UMC 90nm SP/RVT LowK Logic Process
Compensation Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY; UMC 55nm SP/RVT LowK Logic Process
Compensation Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY; UMC 55nm SP/RVT LowK Logic Process